Electronics Forum: supplier (Page 191 of 344)

BGA inspection scope - Visual

Electronics Forum | Wed Jun 11 18:22:41 EDT 2003 | Steve

Do you happen to know where I may find a supplier for the "little mirror"? Google didn't produce relevant search results for Mentor. My method of inspecting possible bridging under a BGA involved a small flashlight placed up against the edge of the

Relfow ?

Electronics Forum | Thu Jun 19 20:47:57 EDT 2003 | davef

Your solders could have vasty different liquidous points. Check with your suppliers to determine the appropriateness of the materials you have selected. Awhile ago Jim Zanolli at Teka hosted an OnBoard Forum here at SMTnet. He'd be happy to give y

Counting loose parts

Electronics Forum | Wed Jun 25 18:04:49 EDT 2003 | MikeF

It looks like we'll have to go the conductive process tray route. I looked through web sites for Brick Container and several other esd suppliers and did not find anything that would work. I saw the tray you mentioned in my Techni-tool catalog, but wa

Porosity in Good Plating

Electronics Forum | Sat Jul 05 07:30:04 EDT 2003 | AlCapone

If the problem as you described as the gold plating contaminated, and the Nickel layer exposed to the solder pot. However, the purpose of the gold layer is to protect the nickel and copper layer not turn into corrosion and resist to other issue (humi

solder fillet peeling update....

Electronics Forum | Tue Jul 15 11:18:29 EDT 2003 | slthomas

It is an interesting situation....one that merits as much business philosophy analysis as technical analysis. I'll be getting my official 60 day notice today. Any criticism about our overseas suppliers (that were selected by sr. management w/o in

Cookson selling Speedline

Electronics Forum | Wed Jul 30 21:20:07 EDT 2003 | davef

It's good for Cookson shareholders that something has forced the managers of Cookson to come to their senses, finally. All those aquisitions never made sense to anyone, except the MBAs and lawyers that reaped the fees from all that paper shuffling.

Copper oxide

Electronics Forum | Sat Aug 02 08:12:05 EDT 2003 | davef

Q: So, can I concluded that this greenish "fungus" looking staff is not initiated from high hot air temperature setting ? A: Your temperature setting could have increased the growth rate of this crunchy looking stuff, but we wouldn't start there to

Wave Solder Profiles

Electronics Forum | Mon Aug 11 20:30:05 EDT 2003 | davef

Our old friend Bob Willis posted the best procedure for determining wave solder recipes at his site [ http://www.bobwillis.co.uk ]. In the "Download" section, look for "Setting up Wave Soldering System (Plain Text Format)". It was written, last we

Mishandled OSP

Electronics Forum | Fri Aug 15 09:56:50 EDT 2003 | russ

A lot of this depends on the initial quality of the OSP. I have had boards that aren't any good being stored air tight for one day. While believe it or not, I recently used boards that were opened and sat for 1 1/2 years and we built them with no pr

Screen Printing for BGA

Electronics Forum | Thu Aug 21 16:58:25 EDT 2003 | justin

With a eutectic ball, you'll see about a 50% collapse. This negates that .008" issue you're referring to. With a high temp ball, you don't enjoy the same freedom regarding ball collapse. Dave is correct, though. We recently got IBM to sign up to


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