Electronics Forum | Mon Sep 17 08:40:04 EDT 2001 | dave_bond
I have done a search of the Forum and didn't really see what I was looking for. We could be doing a 12" x 10" x .060" single sided ceramic PCB with all surface mount devices. Are there any "secerts" or "things to watch out for" when processing cerami
Electronics Forum | Sat Sep 22 14:33:50 EDT 2001 | Tony
I like to secure the thermalcouples with a small dot of chip-bonder(surface mount adhesive). The chip-bonder will cure durring the first pass through the oven. After I have developed my profile I remove thermalcouples and the chip-bonder with a solde
Electronics Forum | Mon Apr 01 13:11:33 EST 2002 | BTaylor
I would like to know if this group has any preferences to any capacitor manufacture. Any good or bad experiences with certain companies, we are going through some issues. This group has many years in this field and I would like to hear your feedback
Electronics Forum | Tue Jun 04 12:26:40 EDT 2002 | Hussman69
If you have solder balls in vias on the "component side" it probably is your wave solder process. Most waves have an option that is designed to make sure your surface mount parts solder - but if turned up too high, can actually push solder up throug
Electronics Forum | Tue Nov 05 09:21:18 EST 2002 | stefwitt
After all, you may want to consider a Flip Chip process. The chips are bumped with tiny solder balls while still on the wafer. You may present the bumped chips in Gel Pack, trays or Surftape to your Pick $ Place machine ( if capable for Flip Chip pl
Electronics Forum | Sun Jan 19 10:25:54 EST 2003 | davef
You shouldn't freak. You want the pads on both sides of the BGA ball the same so that the torgue from changes in dimension due to different CTE [ie, interposer, solder, bare board, etc.] is balanced on the top and the bottom of the ball. So, the ma
Electronics Forum | Wed Jul 02 14:25:14 EDT 2003 | Earl Wildes
Greetings. Does anyone know of a good reference on the proper physical handling of surface mount devices? We have a number of very small builds, so our stockroom is very often issuing single piece quantities. The parts are protected from ESD, but
Electronics Forum | Fri Oct 03 08:41:00 EDT 2003 | gregp
JEDEC and IPC for instance do have conventions. But they are only typically for existing part types and do not coincide with one another. I think the bigger problem is the new components and the unusual components that don't seem to fall into any p
Electronics Forum | Mon May 10 18:05:31 EDT 2004 | daman
We are trying to solder a Surface mount relay having lead free finish on the leads. The leads are not getting soldered down during the reflow. The leads also look oxidized (failed our solderability test) but we don't have an option but to use these r
Electronics Forum | Tue Aug 24 16:06:09 EDT 2004 | Robert Ack
Being a surface mount department manager for well over 6 years I have seen this countless times. While we run mostly water soluble I havent seen any negative issues while running boards through the oven twice. Sometimes we even spray an additional am
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