Electronics Forum | Tue Jul 28 02:22:59 EDT 1998 | Bob Willis
Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface under
Electronics Forum | Fri Jul 10 08:31:03 EDT 1998 | Greg Curler
We are considering the use of compliant pin connectors on surface mount assys instead of pasting thru-hole connectors (boards can't be wavesoldered). We are looking at VME mother & daughter connectors, and compiant pin sockets that would replace PGA
Electronics Forum | Tue Jun 30 07:23:47 EDT 1998 | Marjan
I would be very grateful if someone could provide me with recent figures (schemes)of 1. pin through hole assembly 2. hybrid circuit 3. surface mount technology. Or could anyone tell me where I can find such information? Thanks a lot. Marjan.
Electronics Forum | Fri Jun 19 10:03:46 EDT 1998 | Earl Moon
| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, We and ind
Electronics Forum | Mon May 18 13:18:25 EDT 1998 | Chrys
I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and soldera
Electronics Forum | Wed May 13 14:22:17 EDT 1998 | JoSi
Hi, There has been a lot of disputes in our company about changing present HASL to another Finishing which can provide more flatter pad surface in fine pitch applications. ( perhaps Ni/Au, OSP ) The target is to reduce solder defects, thus improve
Electronics Forum | Thu Apr 16 08:07:05 EDT 1998 | Stan
Currently I am in the buisness of soldering bare die to the top surface of a copper heat sink. Is any one else have some exprience in this process that can help. We heat a copper slug through a contolled atmosphere, place a preform then a bare die.
Electronics Forum | Tue Mar 24 09:48:15 EST 1998 | Steve Schrader
| Do you know if there is an IPC standard or industry standard | that addresses the proper process for handling MSD's in the production environment....? (rework etc.) | Not the receiving area. | Thanks so much, | Robin Arnold | PCB Development | Har
Electronics Forum | Sun Mar 01 13:18:42 EST 1998 | Sam Sangani
Are you using Stencils to apply solder Paste for your surface mount PC board ? If so, please visit our web page http://www.pnconline.com/stencil.htm We make Laser Cut stencil with Re-Usable ACCUFRAME at lowest cost in the SMT industries. We also wil
Electronics Forum | Tue Dec 30 02:45:36 EST 1997 | Karthik
Hi there, I am looking for dimensions of a surface mount component of 1806 case size (the component is an RF choke). I cannot find it in the PROTEL standard library, or even on the web. Please e-mail me directly or post it on the forum, if you have t
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