Electronics Forum | Mon Jun 30 01:30:14 EDT 2008 | benefon
Hi Well as the feed movement is effected by means of a spring return force there really isn't that much to do apart from checking the spring tension and keeping the friction surfaces of the ratchet mechanisms of the feed sprocket and the top foil pu
Electronics Forum | Tue Jul 15 16:30:57 EDT 2008 | boardhouse
Hi Aj, Recommended Immersion gold thickness would be 3-5 Micro inches over 140 -200 micro inches of Nickel. Thicker Immersion gold than 5 micro inches can cause solder joint embrittlement. Gold readily dissolves in molten solder and will be present
Electronics Forum | Thu Jul 24 22:58:13 EDT 2008 | davef
At the 2004 IMAPS Nordic Conference, Claus W�rtz Nielsson from Nokia Mobile Phones published "The Evolution of Surface Finishes in Mobile Phone Applications" [www.imaps.org/adv_micro/papers/Nordic2004paper.pdf]. Some of the results were: * Corrosion
Electronics Forum | Wed Aug 27 08:06:43 EDT 2008 | davef
Thick, hard conformal coatings of acrylic, urethane and epoxy have a well documented history of causing solder joint cracks and breaking glass/ceramic and other brittle components. Dissimilar expansion and fairly high surface bond strengths of the ma
Electronics Forum | Wed Sep 10 12:44:55 EDT 2008 | vladig
Well, it wasn't as easy to figure out the root cause. The last image is below. It shows how the board finish looks like (the trace was under solder mask). AS you can see, the layer of E-Ni is spliting (the board shop admitted the problem afterwards).
Electronics Forum | Wed Sep 10 17:12:55 EDT 2008 | gregoryyork
I dont know about analysis on boards it is OK as long as the people carrying it out know how to interogate the answers.I worked on a problem just last week where an analysis house in China tested the resist then the pads and found on both surfaces C
Electronics Forum | Sun Sep 07 09:57:23 EDT 2008 | davef
We have BGA connectors on rigid laminate. Points are: * We love BGA connectors for mating mother/daughter boards because they eliminate the wave solder step required for PTH connectors. * BGA connectors are very tricky to assemble, much trickier than
Electronics Forum | Thu Oct 02 12:22:26 EDT 2008 | JerryS
Hello Ok there is not much info here. What you have to mae sure of is several key factors. 1. Have you entered the correct stencil thickness. 2. Are you using the stencil gerber (not the paste layer) The paste layer is usually not adjusted for ap
Electronics Forum | Mon Nov 10 16:43:24 EST 2008 | markgray
Steve, I finally played with it enough that it is working again. I ended up with Edge Threshold: 19; Intensity Threshold: 60; Offset: 200; Gain: 16 The problem seemed to be with the Intensity Threshold. I was not getting an error code on the screen
Electronics Forum | Fri Dec 12 12:01:44 EST 2008 | realchunks
As the technology has changed towards surface mount, so has the applying adhesive. In the past clinching parts would have knocked off SMD parts, but no that has all changed. So applying the adhesive via screen print is common and any thru-hole part
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