Electronics Forum | Thu Sep 18 17:11:57 EDT 2008 | realchunks
When looking at surface mount equipment you also have to remember your line pull process. Wil you issue reel of parts or just strips? Most of the bigger machine cannot take strips of parts. What about your set-up? Will you have a dedicated top an
Electronics Forum | Thu Feb 12 15:32:15 EST 2009 | gtemkin
A few other data points to consider. My experience working with Dymax 984LVF material was that its UV cure must be initiated immediately after coating, otherwise is surface will remain tacky forever, something like a post-it note tackiness, which wi
Electronics Forum | Fri Nov 13 07:03:44 EST 2009 | davef
Loco [snip] "The print mode is another consideration. Printers are designed with a squeegee bar and a flood bar. In flood mode the flood bar spreads the paste, and in print mode the squeegee applies pressure, such that the actual printing takes plac
Electronics Forum | Tue Jun 07 08:31:57 EDT 2011 | bootstrap
I am building a rugged digital video camera product that essentially is just a sandwitch of 3 parts: #1: front piece is machined aluminum with C-mount thread #2: middle piece is 1/16" printed circuit board #3: back piece is machined aluminum The
Electronics Forum | Wed Dec 07 17:56:36 EST 2011 | conjugate
I am actually a final year student in Brunel University,London. I`m just started with my major project and the main objective of this project is to perform feasibility study on automation in dust removal. My project title is Automatic PCB Surface Cle
Electronics Forum | Thu Nov 10 10:45:32 EST 2011 | aqueous
The use of IPA in automated defluxing systems is nearly extinct for the following reasons: 1. IPA is flammable. In a spray-in-air environment, the already low flashpoint is even lower. 2. IPA is not a great solvent. There are specific containme
Electronics Forum | Thu Aug 09 07:53:16 EDT 2012 | davef
Allowable bow & twist: Together, both IPC-A-600G and IPC-6012B represent the core IPC documents for describing the acceptable and nonconforming conditions that are either externally or internally visible on finished printed boards. IPC-A-600G relies
Electronics Forum | Wed Feb 20 15:20:34 EST 2013 | hegemon
Depending on your requirements, you could range from a hair dryer, heat gun, toaster oven, hot plate, on up to digitally controlled surfaces and convective systems. You'll have to gauge for yourself whether you are just trying to add some heat energy
Electronics Forum | Thu Aug 27 11:18:05 EDT 2015 | dyoungquist
From your description I am assuming you are doing double sided reflow and parts are dropping off the bottom side when the board is run through the reflow oven the second time. A few ideas to try: 1) Are the parts that are dropping off heavier parts
Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef
We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng
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