Electronics Forum | Mon Aug 28 18:57:41 EDT 2000 | Earl Moon
Steve, This is a good, well repeated, not identified by IPC yet issue. I, and some others in industry, for years have proven and recommended smaller pads for various devices. I, and some others in industry, use 0402 pads for 0603 device types. IPC o
Electronics Forum | Wed Aug 09 22:00:44 EDT 2000 | Dave F
Hey Charles!!! Where in earthly heaven did you get a TO263 with "large solderable tab (approx 8mm square) on the back and 5 leads"? All the TO263s that�ve reached-up and smacked me have been "TO220s" with a modified tab and three leads that are f
Electronics Forum | Tue Jul 18 20:10:09 EDT 2000 | Dave F
Hey Bud: Thanks for the response the other day. We currently use "Jeff�s Method #2: The Drummel Tool." Short answer to your brother is ... yes, probably. Expanding a bit: � It would be surprising not to use a flux to help reflow the solder balls
Electronics Forum | Thu Jul 06 20:46:17 EDT 2000 | Dave F
Mark: An area of increasing interest to all of us. From the SMTnet "Terms & Definitions" (or whatever they call it) Globtop. Encapsulant. Encapsulating. Encapsulation. Potting. Enclosing an article in an envelope of adhesive or encapsulating co
Electronics Forum | Wed Jun 14 08:08:56 EDT 2000 | Wolfgang Busko
Hi ji tae, we had a similar problem with QFPs 0,5 pitch processed by one subcontractor. The symptoms we noticed were: - the solderjointshape and wetting looked normal - the surface had a dull gray appearance - by pushing a lead sideways with a tweez
Electronics Forum | Sun May 21 05:54:04 EDT 2000 | Sal
Currently manufacturing double-sided PCMCIA cards with a nickel/gold finish, which are 0.0235thou in thickness, using surface mount carriers. Problem we are seeing is when building the densely populated side on the second pass we are seeing lifting o
Electronics Forum | Wed May 10 19:58:19 EDT 2000 | Steven J Adamson
Hi Stuart, just to be clear right from the start I work for Asymtek, so you know where this reply is comming from. I agree with Jax and Micah that to purchase Fuji or Camalot will probably be a system that you are more familar with, so the learning
Electronics Forum | Tue Apr 11 20:26:16 EDT 2000 | Dave F
Jeremy: Parts assembler make leads of either Alloy 42 (Invar, whatever) or copper. The solderability of these leads are protected with eutectic or non-eutectic tin/lead solder, palladium or some palladium alloy, or gold. Cuppla things to consider:
Electronics Forum | Wed Mar 29 09:31:28 EST 2000 | Erick
Marc: My experience found reliability IS a function of operator skill and attension to the process. Expecially for some RF assemblies. I worked with an engineer from Rogers to develope a process for reworking Pads for a special material. (I thing
Electronics Forum | Thu Mar 16 14:04:14 EST 2000 | Cartman
Greetings. My company has a VOC-Free no-clean wave solder flux with 4% solids. I have a number of questions as they relate to our ICT Fixtures. Currently, we're encountering the following issues: 1.) PM on probes....What is the recommended PM p
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