Electronics Forum | Tue Jan 25 21:59:44 EST 2000 | Dave F
Michael: On reliabiliity, consider that: � IPC-SM-782, "Surface Mount Design And Land Pattern Standard" and IPC-D-279, "Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies" specifically describe via in pads as "poor des
Electronics Forum | Wed Feb 09 06:35:18 EST 2000 | Mark Williams
Hi We use 2 criteria... maximum void size is 10% of the solderable surface and a maximum area of voids of 10% of the maximum cross-sectional area of the ball. Any views Mark
Electronics Forum | Wed Jan 05 09:44:45 EST 2000 | Millerin Claude
Some PCB's manufacturers are now able to fill the hole and then re-metallized the pattern in order to obtain a final soldering surface perfectly flat but with an electrical connection under. This of course increase the price of the pcb but avoid any
Electronics Forum | Mon Jan 03 11:33:15 EST 2000 | Zaklas, Yosef
Dear Sirs: We use BGA ceramic components in our assemblies. We would like to know if there is a technical problem of SMT assembly and reflow of these components on aramid surfaces. Yours immediate reply would be appreciated.
Electronics Forum | Wed Jan 05 08:36:44 EST 2000 | Doug Philbrick
MPM has a section on thier web page that is a glue printing tutorial. Visosity is the key ( aperature is very important also of course). Too runny of a glue won't work well, just lke paste.
Electronics Forum | Fri Jan 07 05:35:38 EST 2000 | Jacqueline Coia
Could you please tell the address of MPMs web page, as I am also interested in this tutorial. Cheers
Electronics Forum | Mon Dec 20 16:54:13 EST 1999 | Dave F
Contact Steve Biegle with Alpha at (219)922-7990. He has a lot of good data which you can review and use to set-up your own testing/evaluation process.
Electronics Forum | Fri Dec 03 08:06:23 EST 1999 | Mark Anderson
Firstly, Verify your Z-height per the procedure in the Maintenance manual. In general, release the placement stopper and rotate cam onto flat surface of board with z-axis at zero. There should be 0.15 mm compression of the spring
Electronics Forum | Mon Nov 08 14:18:10 EST 1999 | John Thorup
Reduced Oxide Soldering Activation is an electrochemical method of restoring the solderability of surfaces. Searching the archives of IPC technet and this forum will reveal more details. John Thorup
Electronics Forum | Thu Oct 28 04:42:09 EDT 1999 | Dubron
Hi, I'm Michael Dubron, french student at University. I'm studying surface mounting technology for a training. I need informations on this topic to make my report. Thanks michael.dubron@caramail.com
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