Electronics Forum: systemation (Page 266 of 593)

Solder impurity tester

Electronics Forum | Sat Jan 17 13:25:04 EST 2004 | bob Willis

I believe this is the only system on the market place and was developed by Panasonic in Japan with Malcolm. As stated it does check a limited number of elements but that was its intention when produced. I believe that only high volume shops would u

Board Support During Pick & Place

Electronics Forum | Fri Feb 13 17:55:49 EST 2004 | Dale Freeman

I populate several thin panels (0.032")using a Samsung S-2000 P-N-P machine. With panel sizes of 8" by 10", it is very difficult to clamp the panels into the machine with deflection and bowing. Also, the Samsung makes it very difficult to adjust the

Board Support During Pick & Place

Electronics Forum | Mon Mar 01 23:37:49 EST 2004 | Bill Ladakos

I would recommend trying a Board-lok Tooling support fixture. In my opinion, no other tooling support system or fixture compares to the type of support board-lok provides. They can manufacture the board-lok with many options such as vacuum, tooling p

Contact Systems CS-400E Optical Correction

Electronics Forum | Mon Feb 16 07:11:25 EST 2004 | paul_bmc

Does anyone know how often the optical sensor goes bad on the CS-400E machines. I have 2 machines and it seems that the optical correction does not work anymore. I keep getting an optical correction error, when the mode is turned on the correction

Higher TG for PWB when soldering Lead Free (?)

Electronics Forum | Mon Mar 08 11:42:05 EST 2004 | Jay

Sn-Ag, Sn-Sb, and Sn-Cu based lead free alloys have a higher melting point than that of Sn-Pb eutectic system. Thus, it will be better if you can use a higher TG PCB for lead free purpose. But, also most of commercial products including SAC can be

Stencil printing for 15.7 mil qfp's

Electronics Forum | Wed Mar 03 07:29:34 EST 2004 | pjc

2D will give you on-line contrast inspection for paste coverage on the land. I would go with 2D on the printer when comparing to an AOI that will do the same contrast inspection. There are systems out there that will check paste hieght and area cover

Voiding in board to BGA joints

Electronics Forum | Tue Mar 09 22:13:20 EST 2004 | Ken

What x-ray system are you using? Check out Dage. I bet you have voids...just can't image them. Why the fuss over voids? Voids terminate the crack propegation and can extend the time to failure for creep fatigue. I would not be concerned unless yo

BGA rework

Electronics Forum | Sun Mar 07 19:58:03 EST 2004 | praveen

Hello , Can any body help in solving the problem of PCB warpage during BGA rework. I am using IR heating system. No problem found in reworking BGA's size less than 30mmx30mm but for 35 mmx35mm and above BGA get solder short due to PCB warpage. Note

BGA rework

Electronics Forum | Fri Mar 12 12:59:50 EST 2004 | babe

Sorry for the late reply, I am an ersa dealer may I suggest mounting an alternative thermocouple attached to a DMM in close proximity to the BGA. See what the differences are in your readings from the DMM and the Digital temp reading on the IR550A. I

Contact Systems CS-400 E problems

Electronics Forum | Wed Mar 10 11:19:59 EST 2004 | mrmaint

Paul, I have seen harness issues in the past that have given some unusual results. The problem we found was that depending on the rotation and position of the cut/clinch unit the opens/shorts were not consistent. The first place i would look is at th


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