Electronics Forum | Tue Aug 22 10:53:45 EDT 2000 | Dr. Ning-Cheng Lee
Excellent question. Alloy development is relatively easy compared to flux formulation. New fluxes for Pb-Free alloys need upgrades in 2 critical areas: 1) thermal stability 2) oxygen barrier efficiency Since the Pb-Free alloys require reflow proce
Electronics Forum | Thu Jul 20 16:15:24 EDT 2000 | Bob Willis
Sorry at the moment I do not have information but as usual I want to get some hands on sessions going. We were doing a flip chip workshop hands on session for Speedline last week in England. We did the theory and then hands on soldering and underfill
Electronics Forum | Thu Jun 22 16:59:18 EDT 2000 | Lee
I'll be real brief, because of time, but feel free to contact me later (lgoldberg@chipcenter.com). There is big conceren (somewhat well-founded but a bit overblown) about lead form electronics products leaching into the environment when they are land
Electronics Forum | Fri May 04 18:55:49 EDT 2001 | johnthor
actually the "yellow lite" part of my posting was simply spoofing Dave's light up band-aid wrappers. But seriously (again) most high temperature Kapton polyimide film tapes, like 3M #92 and #1205, develop a considerable charge when unrolled or remov
Electronics Forum | Mon May 07 09:47:45 EDT 2001 | orbotech
An ultimate truth in AOI is that "you can not avoid what you can not see". At the post solder stage, 2D inspection is typically not enough as it simply "can not see" everything using a single perspective, and therefore, can not detect all of the faul
Electronics Forum | Thu May 10 10:33:46 EDT 2001 | Eyal Duzy
Genny, I would like to correct part of the things that you were told. As far as I know, X-Ray tools are not positioned as tools to find solder volume simply because it is not a strong point for them. An X-Ray image is either a projection (2D transm
Electronics Forum | Tue May 15 10:02:20 EDT 2001 | John
I should have been more clear;the temperature that I indicated was measured inside the dispenser cabinet. We setup a very simple system to monitor and maintain the temperature inside the cabinet. By comparing our temperature to our production resul
Electronics Forum | Tue May 22 17:21:43 EDT 2001 | davef
BGA require placement accuracy of only 0.3mm (�12 thou), compared with a required placement accuracy of 0.08mm (�3 thou) for fine pitch devices. Even with this level of misalignment, plastic BGA self-center / self-correct during reflow due to symmetr
Electronics Forum | Thu Jun 14 23:34:43 EDT 2001 | uk boy
I studied in the UK, so I am not sure about the US educational system. My mate studied at the Illinois Institute of Technology and he is a much smarter than me so I guess you Yanks are doing something right! ;-) I agree mostly with davef. Theory
Electronics Forum | Sun Jun 10 12:47:36 EDT 2001 | procon
Hi Jacob, NC vs WS, what a story! No-clean paste means no-clean for your products but what a mess it makes in your reflow systems. If you are a contract maunufacturer of high volume production, then No-Clean is they way to go. This helps keep your co
