Electronics Forum: systemation (Page 541 of 593)

Feeder Communication

Electronics Forum | Thu Nov 29 15:52:53 EST 2007 | jmelson

Some other machines are a lot simpler. Here's how the Philips (mady by Yamaha) CSM84 works. Smaller tape (8 and 12 mm) feeders are all mechanical. A plunger on the head pushes a lever on the feeder at the same time the head comes down. First, the

Solder Paste Inspection Systems

Electronics Forum | Wed Jan 30 12:53:58 EST 2008 | tonyamenson

In approximately one month I am installing 2D at our DEK print station. We are going with the basic (cheap) software options and 2D camera. After it is up and running we will determine if it is indeed useful. At that point we will decide on the adva

BGA Voids

Electronics Forum | Wed Feb 13 09:17:47 EST 2008 | scottp

The causes of voids are extremely paste dependent. I did a literature search a couple years ago and the papers all disagreed with each other - one would say turn knob "A" to the right and the next would tell you to turn it to the left. I did my own

THT manual assembly worker instructions

Electronics Forum | Sun Feb 24 19:10:17 EST 2008 | larryd

Skill and experiance level of assemblers is critical. High skill and experiance with the type of assembly, print and BOM and hgihlighters. Day labor would be 5 to 10 components for each assembler, already prepped with pictures or drawings showing wh

BGA not level when placed

Electronics Forum | Mon Feb 25 11:12:32 EST 2008 | hegemon

It sounds more as though you have a profiling problem primarily, however, if your placement is not square to the board, then you should get your machine setup correct first. After that you can get to the profiling. If the BGA is brought up to tempe

any suggestion will be appreciated

Electronics Forum | Wed Mar 12 09:02:40 EDT 2008 | davef

Your question implies that you would like to find a way to use the device you received with the BOM, rather than returning the part for the correct item. Given that situation, choices are: * Glue the part on the board bug-up [upside-down] and run jum

Solder wetting to ENIG pads

Electronics Forum | Tue May 13 08:26:29 EDT 2008 | davef

First, on your reflow temperature comment: The 183*C focus for reflow recipes for tin-lead solder is a falicy. If you held a recipe for tin-lead solder at 183*C peak, it would never reflow. Recipes for tin-lead solder need to be at liquidus plus 20*C

Selective Solder Recommendations

Electronics Forum | Wed Jul 02 09:22:20 EDT 2008 | dmunson

Thanks Real Chunks. We currently have an RPS opus selective solder machine that we plan on keeping. It is configured as a 3-nozzle (!) one-pump (!!) point selective solder machine w/ nitrogen preheat. Custom wet nozzles. We use lead free SN100C sold

Is the demand for in-circuit testing still high for PCBA?

Electronics Forum | Fri Aug 08 11:37:09 EDT 2008 | pjc

Yes, sure. In fact in some applications ICT is coming back. Mainly due to the fact that more and more SMT discrete components have no markings, so AOI cannot tell you if you have the correct value on the PCB. Fixed pin or flying probe ICT is a valuab

Solder not reflowing properly

Electronics Forum | Fri Aug 29 10:37:44 EDT 2008 | gdzuber

Very interesting problem because it shows how systemic this kind of problem can be. So many variables, right? Firstly, discussions here are similar to everyone's postings, but there are some different observations. The manufacturer��s profile, we t


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