Electronics Forum: tacflux and 0

QFN's and LGA's

Electronics Forum | Tue May 26 15:39:16 EDT 2009 | mikesewell

Amkor's MLF guidelines are very similar to Actels. 1 to 1 on the stencil to part pad on the I/O pads, 75% with a grid windowpane, 0.125 mm/5 mil stencil. For example, the Actel area ratio for a 0.3 mm sq. pad and 0.125 mm stencil is 0.6 which seems

IP1 and SSOP28

Electronics Forum | Tue May 18 16:40:22 EDT 2010 | m79d

I am having some problems getting the IP1 to place a SSOP28 package,pitch 0.65mm lead width 0.3mm. I am selecting computer vision 012 (tried 011) and vision type 100. EL data was put in looking at the datasheet and also measuring the device. Have tri

Fuji Pick and Place Machines

Electronics Forum | Sat Jun 05 08:18:03 EDT 2004 | vinitverma

Hi Grant, If you're really looking for speed, I'm sure you're looking for another machine for doing the QFPs, BGAs stuff etc. In that even, why not have a look at the long proven Assembleon FCM machine!! It is a totally different concept with UNMATC

Sale and service rep for LV9200

Electronics Forum | Mon Jul 25 16:03:44 EDT 2005 | pjc

August Technologies, http://www.augusttech.com Taiwan: 7F-9, No. 81, Shuei-Li Road Hsinchu, Taiwan 0300 Tel: +886 (0)3 516 9230 Fax: +886 (0)3 516 9231 Korea: KoMoFo Tower 4F #16-3, Sunae-dong, Bundang-gu Seongnam-si, Gyeonggi-do 463-825 Korea Tel

BGA dead bug pick and place

Electronics Forum | Wed Jun 09 02:35:10 EDT 2004 | Bernard

Base on the PORON foam rubber recommended, is it possible to apply on small BGA chip of 4x4 ball size 0.3mm. Any specific part no and supplier for this type of foam and is it a anti-static material? Would it be possible to punch out at dia. 3mm?

uBGA PCB design and stencil design

Electronics Forum | Mon Oct 21 23:48:13 EDT 2002 | harris

Hi: If anyone have the experience with the PCB pad design and stencil design for the uBGA? We meet the problem for it. The component data is 0.3mm diameter and 0.5 pitch. Could anyone tell me the PCB pad dimension, the stencil type and aperture dimes

soldering and bonding on gold PCB's

Electronics Forum | Mon Jan 07 20:37:15 EST 2002 | davef

For soldered areas, we like to keep gold thickness substantially below the maximum you propose. Search the fine SMTnet Archives for our discussions on the topic of acceptable levels of gold with solder connections. Let�s fix this �no one seems be s

Fuji cp3 and ip2 placement speed

Electronics Forum | Mon Aug 12 18:26:05 EDT 2002 | pjc

If you are talking actual placement rate- from first fiducial read of board no. 1 to first fiducial read of board no. 2, here is the best I've ever seen based on the boards I've run: CP3- 141 seconds for 468 components per board (all rectangular chi

Fuji CP6 and IP3 specifications request

Electronics Forum | Tue Aug 09 11:14:28 EDT 2016 | cyber_wolf

•Rated Speed of 40,000 CPH •140 - 8mm Device Locations •14" x 18" Max PCB Size PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm Board Thickness: 0.3 to 4.0mm Component capacity Up to 140 types (8mm tape) Placing rate 0.09 sec./component - 40,

BGA 0.5mm pitch Ball 0.3mm assembly and soldering.

Electronics Forum | Wed Dec 26 14:21:47 EST 2007 | gersla

I am looking for suggestion of BGA 0.5mm pitch Ball 0.3mm (BGA 8x8mm)assembly and soldering. Stencil thickness? Stencil reduce? Etc.

  1 2 Next

tacflux and 0,3 searches for Companies, Equipment, Machines, Suppliers & Information

SMT feeders

High Throughput Reflow Oven
Dual Lane Reflow Oven

Training online, at your facility, or at one of our worldwide training centers"
Software for SMT

High Resolution Fast Speed Industrial Cameras.
2023 Eptac IPC Certification Training Schedule

IPC Certification Training from the comfort of your home or office

SMT & PCB Equipment - MPM, DEK, Heller, Europlacer and more...