Electronics Forum | Wed Nov 19 18:51:22 EST 2014 | warwolf
your summary is pretty accurate! yeah our justification on the automatic system is long in the pipeline. we would need significant volume even then we could just bump the staff numbers. I can see how you are having troubles with the legacy requirem
Electronics Forum | Thu Dec 18 13:07:50 EST 2014 | kevinb
I have worked with Epoxy Technology in the past with silver epoxy. Just to fill you in on what I have been doing with this project in the past. I was using a silver epoxy for my 0201s. I then over molded with an epoxy with a dam and fill. Then th
Electronics Forum | Tue Aug 27 12:56:45 EDT 2019 | surfacemountprocess
It really depends on the assemblies/components that need to be inspected and the available budget. 3D machines are much more reliable at detecting faults while not generating masses of false calls but of course they cost more than 2D machines. I ha
Electronics Forum | Wed Feb 19 12:59:59 EST 2020 | jerlong2020
Hi John, We had a FLIR system with interchangeable lenses and good thermal resolution for the time (15 years ago). I see the new ones now at a fraction of the cost which we paid and they have better resolution. Amazing how the infrared imaging tech
Electronics Forum | Wed Feb 26 13:23:40 EST 2020 | rgduval
I haven't used these clips, or this machine, so... But..in general, I'd use as large a nozzle as you can that fits the pick area of the clip. That should give you the best opportunity at lifting the clip. If the machine has a gripper nozzle (with
Electronics Forum | Sun Jul 26 07:52:35 EDT 2020 | sync40
Hello to everyone, Have you ever experienced soldermask bubbles inmediately after printed the soldermask itself? (for screen printing method of LPISM). I am not talking here about blistering or any outgassing defects after exposing to high temperatu
Electronics Forum | Thu May 13 17:31:48 EDT 2021 | bandjwet
We have a PCB rework dilemma involving a reflow profile. This is a SAC305/Low Solids (aka no clean) process where we are currently hand soldering (5) components that were DNP. The boards have an acrylic coating and we take off the acrylic at the par
Electronics Forum | Sat May 06 08:46:46 EDT 2000 | Dave F
Sal: Now you�re talkin�, buddy!!! Darrell is correct. All things being equal, thermal relieved vias (and through holes) should be the hottest spot on the board at reflow temperatures. Vias are gonna take on solder like drippin�s take to biscuits.
Electronics Forum | Mon Oct 25 15:45:11 EDT 1999 | Dave F
Joe: Lemme see, you�re talking about controlling your manufacturing process within 4.6 defects per 100 opportunities or a 4,600 dpmo rate, a cumulative 99.95 acceptance rate, or a �2 sigma process, right? So, it�s fairly basic stuff, eh? First, yo
Electronics Forum | Fri Jul 23 10:16:16 EDT 1999 | Boca
| | | Dear all | | | Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. | | | Our appliocation is Mainly fabrication of mother boards. | | | Thanks | | | | | In theory, ICT is the classical answer (In-Ci
