Electronics Forum | Wed Jan 06 21:56:37 EST 1999 | Steve Gregory
| Youse: This is SMTnet Steve. Sacrifice the socket. By the time you finish putzing-around removing the balls to get the socket off the board, replacing the lifted pads on the board, and reballing the socket; you've burnt the $100 that the socket
Electronics Forum | Wed Jan 06 23:01:48 EST 1999 | Dave F
| | Youse: This is SMTnet Steve. Sacrifice the socket. By the time you finish putzing-around removing the balls to get the socket off the board, replacing the lifted pads on the board, and reballing the socket; you've burnt the $100 that the socke
Electronics Forum | Tue Dec 29 22:31:06 EST 1998 | Kelvin Chow
It is still a big concern on using No-clean or aqueous cleaning for CSP assembly. I prefer to use no-clean, however, not all components are suitable to use it. Especially those dirty capacitors or connectors which may cause solderability problem. It
Electronics Forum | Tue Dec 29 03:35:10 EST 1998 | Earl Moon
| I am looking for a questionaire/list of items that need to be addressed to determine the pros/cons and equipment, manpower, cost and lead time to determine if one should consider setting up an in-house SMT line. | Can anyone help? | thanks | | L
Electronics Forum | Tue Jan 05 10:17:25 EST 1999 | Earl Moon
| | | Does anyone have any experience with vibration testing of BGA packages and assemblies? We are starting to design BGA's into some of our products and we have not found very much information on vibrational test results. Any information will be
Electronics Forum | Tue Dec 08 17:55:51 EST 1998 | Dave F
1. What is the best way to remove polyurethane conformal coating from selected areas? Your conformal coat material supplier is best equipped to tell you how to remove the coating. Polyurethane conformal coating is not easy to remove. Without in-pu
Electronics Forum | Fri Dec 04 20:37:45 EST 1998 | kallol chakraborty
| | | | | Hi folks , | | | | | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most
Electronics Forum | Wed Oct 28 01:17:57 EST 1998 | Earl Moon
| SMT-ers | | I notice that most suppliers provide data that is eye-catching but avoid providing data of significant technical relevance, such as Cp and Cpk. It would perhaps be a wise idea for standards to be formulated in this area. | For
Electronics Forum | Fri Oct 16 09:12:46 EDT 1998 | Scott Cook
Sorry folks. I'm just a naysayer here. Let's look at this BGA thing...... We've all been successfully processing down to 16 mil FP stuff for years, now--some of us down to 11 mil. Once the printing process was stabilized, paste rheologies were matur
Electronics Forum | Sat Oct 17 10:43:29 EDT 1998 | smd
| Sorry folks. I'm just a naysayer here. Let's look at this BGA thing...... | | We've all been successfully processing down to 16 mil FP stuff for years, now--some of us down to 11 mil. Once the printing process was stabilized, paste rheologies were
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