Electronics Forum: temperature (Page 141 of 341)

wrinkles solder joints after double reflow

Electronics Forum | Wed Mar 24 08:36:58 EST 2004 | Evtimov

Hi! What exatly you do? Do you reflow the both sides of the board at the same time or you reflow your second side? I think in both cases you should decrease you bottom zones. If you reflow both sides - with 10-20C(F) If you reflow the second side - w

Lead-free solder

Electronics Forum | Wed Apr 14 12:23:59 EDT 2004 | Ted

Hi everyone! I am looking for a lead-free solder that will survive a customer reflow of 260C. I am currently using SN10/Pb88/Ag02 but the reflow temperature is to high (320C) for the FR4 boards that we have. I know there are higher temp FR4 boards

Via in pad

Electronics Forum | Fri Jun 11 08:38:55 EDT 2004 | davef

We figured you were going to say that. Pay me now, or pay me later, you call it. As an alternative: * Cover the backside of the via with masking tape that will take soldering temperature, like Kapon, or a temporary solder mask * Enlarge the apertur

No-Clean Process

Electronics Forum | Mon Jul 26 21:00:49 EDT 2004 | davef

If you do not bring your nc flux to soldering temperature [~220*C], it is very dangerous from a product reliability standpoint to leave that material on your board. Consider: * TP-1115 - Selection And Implemetation Strategy For A Low-Residue, No-Cle

Polystyrene Caps through wave solder

Electronics Forum | Tue Jul 27 04:18:55 EDT 2004 | Nippy

Hello, Is it possible to put polystyrene caps through the wave solder process ? We have always hand soldered these as temperature sensitive parts but would rather include them with other PTH parts through the wave solder. Manufacturer was little h

Pitted / Stretched Appearance on Fine Pitch Components.

Electronics Forum | Tue Jul 27 15:15:48 EDT 2004 | JSTARKEY

We have recently encountered a problem that we haven't seen before: The solder joint appears to be wetting ok and the solder is re-flowing but the appearance of the solder after re-flow is pitted. Using Kester 531, humidity around 41% temperature aro

If we could bake the Board with OSP finish?

Electronics Forum | Fri Aug 06 10:07:50 EDT 2004 | blnorman

OSP has limited elevated temperature exposure capability. Couple that with the fact that solvents (IPA in particular) will remove the OSP. The more material you loose the higher the chances for pad oxidation. We ran an experiment with board washin

Lead Free ...

Electronics Forum | Mon Sep 26 20:10:58 EDT 2005 | Anna

What type of alloy and at what temperature do you use for wave soldering? Do you need to modify your machine? I am using SCN but I have problem controlling my bath. Are you running on multilayer board or PTH boards? Do you face any fillet lifting

About IR Basics

Electronics Forum | Thu Sep 02 14:51:28 EDT 2004 | Jovy

Hi All, I Need to know What is the main Concepts and Basics to Use IR in Soldering BGA & mBGA Ics, for Example - what are Range of Heating Temperatures - What is the Preheating means !? - What is the best Heat/Time Curve Ive to care about while using

measument of paste thickness after Screen Printing

Electronics Forum | Tue Sep 07 09:53:37 EDT 2004 | rob

Hi Dhanashekar, I'm with Chris on this one, unless you are carrying out 0201 or ultra fine pitch placement it's a helpful but not critical tool. We found most print errors were avoided using the 2D vision on the printer, combined with plenty of aut


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