Electronics Forum | Sat Jan 05 02:03:19 EST 2002 | hany_khoga
Dear all: For PBGA replacement by a hot air BGA rework station, do I have to follow the same temperature profile as the first original one in the reflow oven? Note that in the rework process I use only Flux paste (no solder paste is used). Hany
Electronics Forum | Wed Jan 30 12:37:49 EST 2002 | jax
nifhail, In a nutshell: Vapor-phase reflow is a process that uses a fluid with a selected boiling point. As condensation of the hot vapor occurs on a cool assembly the assembly's temperature is rapidly raised to match the temperature of the vapor.
Electronics Forum | Tue Apr 09 05:10:39 EDT 2002 | sanchai
Dear sir, Do you have experiment about the temperature cycling and vibration test for reliability testing of surface mount solder attachment. If yes, please give me the soft file sample of parameter setting and testing report.. Thank you very mu
Electronics Forum | Mon Jul 01 17:22:27 EDT 2002 | Daan Terstegge
Tg = glass transition temperature, the temperature at which the glass-epoxy starts losing it's properties as a solid material. daan
Electronics Forum | Thu Aug 22 05:27:42 EDT 2002 | zolasteven
Hi, With regards to reflow oven or furnace, when conducting a temperature profile how does one determine how many points(Parts) on the pcboard to be measured/connected to the temperature profile. And how to determine what parts to measure? Than
Electronics Forum | Tue Dec 17 16:33:26 EST 2002 | davef
I agree with Russ. The hand soldering temperature depends on: * What you are soldering. * What solder paste you are using. * What are the capabilities of your soldering iron. That being said, kind look at 580-650*F as kinda, sorta typical.
Electronics Forum | Sun Jan 26 21:09:32 EST 2003 | Grant Petty
Hi, Ok, thanks for the info, and I had not considered that factor. Is this an issue related to the reflow temperature change in the oven, or a temperature change in normal product use issue? I will check out the standard, and do you know where it's
Electronics Forum | Fri Mar 28 04:57:41 EST 2003 | emeto
more heat.But that's not correct!If convection there are air flaws and bare board has lower temperature than a board with high density.When you have elements on board you hava a vortex and the air flaw invreases the temperature.
Electronics Forum | Mon Jun 09 22:38:31 EDT 2003 | charlly
Hi Dear, Our company makes RAM strip for computers. we are enquiring if there is any standards or practice for SMT assembly environment, such as, room temperature and humidity. Thanks. Best Regards
Electronics Forum | Thu Oct 16 09:48:02 EDT 2003 | davef
We have been unimpressed with the capability and control of temperatures in batch ovens. We are unfamiliar with the oven you selected. Consider investing and using in a external temperature monitor [profiler].
