Electronics Forum | Tue Nov 21 12:35:59 EST 2006 | CK the Flip
It probably depends on the Silver content. We are also using Sn62Pb36Ag2. The paste manufacturer told us that the reason for the small silver content was so that it could wet better to the lead-free component and board finishes bearing silver.
Electronics Forum | Thu Nov 30 12:12:14 EST 2006 | pbarton
I am in the process of characterising a new vapour phase reflow system and am interested to learn if anyone out there has ever come across time/temperature datalogging equipment capable of being run through the entire process (including vacuum) along
Electronics Forum | Mon Dec 04 12:35:11 EST 2006 | Rob
Hi AJ, Issues we have seen: Test houses not explaining results adequately/customers with their own XRF equipment not sure what they are looking for, resulting in lots of goods in rejections/requests to return stock mostly centered around: 1) Lead
Electronics Forum | Wed Dec 20 20:34:09 EST 2006 | davef
We're not real clear on the issue. [Got ourselves wrapped around lead (Pb) versus lead (termination), we think.] That aside, comments are: * Boiling point of lead [Pb] is [/K]: 2022 [or 1749 �C (3180 �F)] * It's possible that the material that com
Electronics Forum | Thu Dec 21 21:37:19 EST 2006 | Jack
Hi Pavel, Real Chunks, Thanks for your valuable inputs..Selecting the correct location for board profiling is critical in determining the solder joint quality. Am I right to say TC wire attachment locations priority should be as below: (1) Thermal
Electronics Forum | Sat Jan 13 03:43:38 EST 2007 | Stephen- SMT engineer trainee
We are now using solder paste(OM325) and I have some problems on the folowing process: 1. We use the solder paste softer(Malcom SP-1) to warm-up for 20 mins, when it just take from refrigerator. Is there any problems for solderpaste performance? 2.
Electronics Forum | Mon Jan 29 10:11:12 EST 2007 | muse95
What does your customer want you to do? I would not want a CM soldering one of my boards with leadfree paste if I didn't ask him to. Whatever you do, get approval first. Two things to consider: If the other components are not rated for leadfree tem
Electronics Forum | Tue Jan 30 12:16:47 EST 2007 | pbarton
We are seeing unusual soldered joints when soldering to components with Pt/Ag metallised terminations. At the margin between the bottom of the component termination and the PCB surface there are a number of blowholes in the bulk solder. There also ap
Electronics Forum | Thu Mar 01 22:21:06 EST 2007 | davef
From our notes ... An intense evaluation was completed in 1992 that involved testing of three board types [6 layer FR4, 6 layer ceramic copper thick film, and a 4 layer copper-invar-copper board] by the Navy Surface Warfare Center, Crane, IN. [Obvio
Electronics Forum | Thu Mar 15 02:25:04 EDT 2007 | Mike Konrad
Dave, I would not recommend use of a multi-meter to determine high quality DI water resistivity readings. There are a number of reasons including a multi-meter�s lack of temperature compensation. We use a Myron-L resistivity meter to accurately de
