Electronics Forum | Thu Sep 06 17:37:05 EDT 2007 | hakerem
Hi Joris - There is an excellent wave solder guide called "Take No Prisoners" that includes instructions for attacking and eliminating solder balls and preventing their recurrence: 1. Increase Dwell Time Solder balls are normally caused by too much f
Electronics Forum | Tue Apr 07 21:56:32 EDT 2009 | davef
electrovert bravo 4050 to find things like: Cookson Electronics News, ISSUE #6 � SUMMER 2002, High Temperature Bravo� 4050 Reflow Oven Available: ELECTROVERT� has introduced a new high temperature reflow soldering system designed for producing lead
Electronics Forum | Fri Nov 04 11:29:46 EST 2005 | JeffP
Jay, I work for a company that manufactures batch reflow ovens however, I will try to be as subjective as possible. For the most part, what others have posted is true. Yes, there is one heating chamber and if the heater does not have enough power
Electronics Forum | Mon Feb 19 14:17:21 EST 2001 | bschreiber
Hi Mark, If you are a user of stencils, you already know that there are literally hundreds of stencil manufacturers out there. If you found one that will allow such hot temperatures, I would be interested in learning who it is. However, I have only
Electronics Forum | Tue Aug 22 16:02:07 EDT 2000 | Dr. Ning-Cheng Lee
If the thermal mass of the products is small, a tent-shaped profile is recommended, with peak temperature around 240C. The hottest spot on board should be less than 250C. However, if the thermal mass of the product is large, such as a large server PC
Electronics Forum | Wed Jul 18 08:00:48 EDT 2001 | davef
250C flass transition temperature - M = coloring agent or opacifier added to F resin with 110-150C glass transition temperature - N = natural color of resin - P = coloring agent or opacifier added to resin - T = natural color F resin blended with
Electronics Forum | Thu Aug 05 10:40:38 EDT 1999 | John Thorup
| What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? Profiling - tedious but important. As said, start with the paste manufacturers recomendation which is usually publishe
Electronics Forum | Fri May 22 16:08:05 EDT 1998 | Steve Gregory
Hi ya' Mike! For low temperature baking, IPC-SM-786A (Procedures for Characterizing and Handling of Moisture/Reflow Sensitive IC's) specifies a low temperature bake that can be done in the component shipping packaging...ya' wanna remove the bubb
Electronics Forum | Thu Sep 27 19:52:28 EDT 2001 | davef
All of the discussion of "environmental controls" are a matter of degree, dependent on the requirements of the product that you manufacture. For example: shops assembling under-the-hood products have different requirements than shops making garage d
Electronics Forum | Tue Jul 16 21:53:51 EDT 2002 | davef
We don't use Sn43Pb43Bi14 solder. We don't make high performance circuit boards that are subjected to temperatures from -55� Celsius to +85� Celsius and vibration requirments at 6g. We don't like bismuth solder alloys, because: * Fatigue life is r
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