Electronics Forum | Mon Jan 08 10:29:15 EST 2007 | jaime39
The water soluble flux residue is staying there because the rinsing temperature it may be too low. The flux needs about 130-140 degrees celcius to become soft. If you are using water soluble flux, as per IPC A 610 standards it needs to be remove comp
Electronics Forum | Thu Jan 04 10:07:07 EST 2007 | Mario Scalzo, CSMTPE
davef is correct. The solder is indeed wicking to the hottest part of the leads. Slowing down the conveyor will alloy the board and component to come to temperature at a lower delta T.
Electronics Forum | Thu Jan 18 05:28:36 EST 2007 | pavel_murtishev
Good afternoon, Profile your oven. Try to increase soak zone as much as possible. This must equalize temperature across the board and leads to prevent wicking. �Spike� as slow as possible after long soak. Do you use tooling for this PWB in productio
Electronics Forum | Tue Jan 09 08:00:29 EST 2007 | pavel_murtishev
Good afternoon, 22C +/-2C, 40%RH +/- 5% is a good starting point. I wonder if any standard requires floor temperature and humidity control. Most of requiremens come from solder paste manufacturers. BR, Pavel.
Electronics Forum | Fri Jan 26 08:44:40 EST 2007 | dsteffler
Had the same thing happen here. If the thermocouple line shorts out the temperature appears to go runaway (999F or whatever the max of your software is). Ours was a short out in a socket where the thermo plugged in to pass through the frame. Regar
Electronics Forum | Tue Feb 27 22:57:50 EST 2007 | davef
1300*C. We didn't realize that components and boards would stand temperatures as high as that.
Electronics Forum | Tue Mar 06 10:35:37 EST 2007 | muse95
Table 4-1 only specs the humidity requirement for bake temperatures below 100C. It is conspicuously absent above that. I believe it is because moisture is in its gaseous state above 100C.
Electronics Forum | Wed Mar 28 14:40:13 EDT 2007 | amelara98
Unfortunately, the facility overseas does not have a profiler. We suspect it is overheating due to a thick pallet and a raised temperature to compensate for it.
Electronics Forum | Mon Apr 16 20:53:56 EDT 2007 | davef
Tell us about: * Temperatures and times of the thermal profile * Where the thermocouples were mounted * Materials involved * Where in the process the 672 BGA component is soldered * Processes that follow that soldering
Electronics Forum | Tue May 01 09:51:51 EDT 2007 | slthomas
Where are you measuring your temperature at? Are you measuring pad/ball interface temp through a hole in the board, or a lead on a different part, or board surface, or.....?
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