Electronics Forum: temporary solder mask (Page 126 of 153)

Re: Conformal Coating Requirements

Electronics Forum | Sun Oct 17 03:36:55 EDT 1999 | Brian

Obviously, clean enough :-) I don't think I've ever seen a specification, although some companies obviously have in-house ones. It would depend on the process used. For ex., if you used Parylene, where the coating is done in a vacuum chamber, you wou

Re: Aperture Reduction for QFP (fine pitch)

Electronics Forum | Tue Sep 21 13:17:29 EDT 1999 | Dave F

snip | I've often been tempted to try something a little different when specifying QFP apertures. Like, for example, using long, tapered triangular apertures arranged in alternating directions. The objective being, get the maximum amount of paste do

Re: no clean rework

Electronics Forum | Wed Aug 18 15:52:21 EDT 1999 | DENNIS FOWLER

| | | Gian | | | | | | You alarm me when you talk of white residues in a "no-clean" process. This should not happen. It sounds like you have compatibility problems between different residues and/or a poorly polymerised solder mask. | | | | | | Ther

Re: DENDRITES

Electronics Forum | Wed Aug 04 08:08:10 EDT 1999 | Paul O.

| | We're getting field failures in a high impedance portion of the circuit. Think the unpopulated pc card has contaminates because we were able to grow dendrites by applying a 9 volt battery across the suspected pad, placed a drop of de-ionized wat

Re: fiducials

Electronics Forum | Wed Jun 09 13:11:29 EDT 1999 | John Thorup

| In past PCB designs I have cleared all traces from all layers | (except pwr/gnd) from fiducial area. It has come to my attention that this is only necessary on the side where fud is placed. Which is the correct method of design using a fidicial?

Re: SMT Bead Shearing

Electronics Forum | Fri Nov 13 14:35:29 EST 1998 | Dave F

| Anyone using SMT "Fair-Rite" beads? We have a P/N 2743019447 that we're using. We need to know the shear force strength of the part and the vendor's man who knows is in Deutschland and can't help until Monday. I can't wait that long. | | Also, do

Re: SOLVENT/PROCEDURE TO REMOVE CURED EPOXY ON SMT COMPONENTS

Electronics Forum | Wed Oct 21 14:28:17 EDT 1998 | Earl Moon

| I'M LOOKING FOR A SOLVENT TO MAKE REMOVING EPOXY FROM THE BOTTOMSIDE OF BOARD ON SMT COMPONENTS. THIS IS MOST IMPORTANT AFTER THE EPOXY HAS CURED AND EVEN RAN THROUGH THE WAVE. I'M LOOKING FOR A WAY OF | MAKING THE REWORK PROCESS ON THE CURED EPOX

Re: Solder Spotting on Gold

Electronics Forum | Thu Aug 06 10:24:01 EDT 1998 | Mike

Bob I have had problems with spotting on gold contacts for many years and have spent many hours working on ways to solve this problem. Once a source of the problem is found and corrected the next month another source will crop up (new operator on th

Cleaning PCB's after routing

Electronics Forum | Fri May 22 22:18:18 EDT 1998 | David Newman

Hello, I am looking for suggestions for cleaning pcb's after the routing (fabrication) process. Keep in mind that these pcb do not have components intalled on them yet. We have considered pre-drilling the routing plunge points, but cost and capacity

water soluble marking pen

Electronics Forum | Mon Nov 12 16:12:55 EST 2001 | davef

Years ago, we used a specialty-marking pen like you describe. The pen has: * �Fluxmarker 6135 W BELMONT CHICAGO IL 60634 / 1-312-889-8323 Illinois / All other states Toll Free 1-800-621-0080 bla bla bla � marked on the barrel. A quick search with G


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