Electronics Forum: tenting thickness (Page 1 of 2)

Soldermask color relating to thickness

Electronics Forum | Sun Nov 24 20:43:15 EST 2019 | sssamw

If you want to check if solder mask on tented via, better to do cross section to have a clear view. Sometime supplier will not tell you the truth once you ask question for potential quality issue.

Soldermask color relating to thickness

Electronics Forum | Fri Nov 22 05:04:07 EST 2019 | SMTA-Matthew

We have some circuit boards where the solder mask seems clear instead of green on top of some of the tented via pads. No gold deposited during the ENiG process and no solder sticks to it but why is it clear and does it have any correlation to the thi

Soldermask color relating to thickness

Electronics Forum | Fri Nov 22 16:19:45 EST 2019 | davef

I'd guess ... + Pads have no solder mask, clear or otherwise. + Pads won't take solder, because you're trying to solder to nickel. + Nickel on the pads is oxidized and is sticking out its tongue at the flux you're using. + Something went south

Re: Plating crack

Electronics Forum | Wed Sep 27 19:37:32 EDT 2000 | Dave F

Wolfgang is correct. Copper plating thickness of the via barrel walls is a key question you need to answer to troubleshoot this. Tenting is a red herring.

Re: BGA PAd Soldermask

Electronics Forum | Mon Feb 21 11:22:21 EST 2000 | K. Ckak

Hi Kurt, I agree with Dave F. I had exact same problem with PBGA placement. We requested our PCB vendor to plug/tent via (button printing) after HASL with SR1000 which worked well in the long run. There are couple of failure modes associated wit

Re: BGA PAd Soldermask

Electronics Forum | Mon Feb 21 11:22:21 EST 2000 | K. Ckak

Hi Kurt, I agree with Dave F. I had exact same problem with PBGA placement. We requested our PCB vendor to plug/tent via (button printing) after HASL with SR1000 which worked well in the long run. There are couple of failure modes associated wit

Re: Need advise on regarding Vias

Electronics Forum | Tue Dec 14 01:05:09 EST 1999 | cklau

Hi All I have a 0.7 mm diameter hole for vias, what�s the minimum annular ring for this hole diameter? Ans: Fur inner layers Min = .006" hole-pad annular ring ; inner pad dia - hole dia/2 For outer layers Min = .005" hole-pad annular ring ; outer p

Re: Need advise on regarding Vias

Electronics Forum | Tue Dec 14 22:17:33 EST 1999 | Dave F

Armin: How ya doin� bud? CK gives good advice, but I'd like to take a bit of a different angle. Q1. For 0.7 mm (0.027in) diameter hole for vias, what�s the minimum annular ring for this hole diameter? Depends on what you�re trying to do. For in

how to prenvent flux risidue in the blind vias.

Electronics Forum | Mon Feb 19 22:56:20 EST 2007 | davef

Russ We agree with your comments on plugging from one side only. But... We believe that it IS possible to trap process chemicals [technically, not flux] in a blind [or any other] via. This can be done by plating the via closed, rather than pluggi

Re: PCB Standards

Electronics Forum | Wed Jun 10 18:40:00 EDT 1998 | Earl Moon

I am looking for the Industry standards on vias. Are they required to be plated with solder or is copper plating enough? What about reliabilty with either one? Also, if tenting the via is required should it be copper plated or solder plated over

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