Electronics Forum: teradyne and versus (Page 1 of 2)

Re: CuOSP and IMM Silver versus HASL

Electronics Forum | Thu Aug 31 21:15:46 EDT 2000 | Dave F

From the SMTnet Library try: http://www.merix.com/resourcecntr/papers/osp.doc http://www.merix.com/resourcecntr/papers/hasl_alt.doc http://www.itm-smt.com/articles.html * "Organic Solderability Preservatives" * "OSPs - Better Living Through Modern Ch

CuOSP and IMM Silver versus HASL

Electronics Forum | Thu Aug 31 12:17:56 EDT 2000 | mike weekes

We are considering alternative Board Finishes to our existing HASL process. The HASL effects opens on 25 and 20 mil packages after reflow and we know if the advantages of CuOSP and other alternatives. OUR Concern: Is there a shelf life and handlin

Re: CuOSP and IMM Silver versus HASL

Electronics Forum | Thu Aug 31 18:59:55 EDT 2000 | Brian W.

Our customers use OSP, HASL, immersion tin and immersion gold as board finishes. If I recommend a finish to the customer, it is one of the immersion finishes or OSP. Those finishes have the advantage of a flat surface to deposit paste. HASL has va

tape and reel components

Electronics Forum | Mon Sep 16 12:55:27 EDT 2002 | davef

We send parts out to be tape & reeled. We do not send all loose parts out to be tape & reeled. As you would expect, we base our decision on: * T&R service company lead time * Our production schedule * Cost benefit of T&R versus some other productio

AOI, Quality and SPC

Electronics Forum | Wed Mar 05 12:23:31 EST 2003 | msivigny

Hello Phil, We did use an Oracle relational database with an Access front end to input and query data from the system for reports. We did not perform SPC with the Oracle dB. As the whole data collection process was completely customized, we hadn't im

Heat guns and component damage

Electronics Forum | Tue Jan 31 14:14:03 EST 2006 | samir

Ah, yes. The age-old battle of Production Supervision versus Process Engineering. I guess you just need to tell your Process Engineer, "Pretty please with sugar on top, investigate this f*cking issue."

ICT and specifying PCBA testing

Electronics Forum | Mon Mar 29 12:10:14 EDT 2010 | rway

Test Jet will work for catching lifted leads, certainly. X-ray is the only thing for testing for internal solder defects such as voids and cracks. I personally do not have any experience using X-ray, so I cannot advise on its reliability. Perhaps

How to place HDM and VHDM connectors

Electronics Forum | Wed May 23 19:07:40 EDT 2001 | davef

These installation procedues will get you started http://www.teradyne.com/prods/tcs/products/hpi/vhdm/techbull.html

Standard pad sizes for reflow and wave

Electronics Forum | Thu Sep 02 21:02:55 EDT 1999 | Paul Wareham

We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes?

OSP and getting full pad wetting??

Electronics Forum | Fri Apr 18 14:25:51 EDT 2014 | horchak

what is the technology? Is there fine pitch, double sided, number of layers, lead free? If the pcbs are not of the highest quality you may be set up for failure with no clean process. Couple things to look at is your paste flux content versus medal

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