Electronics Forum: test chamber (Page 1 of 6)

BGA failure when chamber test

Electronics Forum | Mon Mar 21 12:34:58 EDT 2011 | scottp

If there was a ball in cup defect on the original assembly then it could behave like you explained.

BGA failure when chamber test

Electronics Forum | Mon Mar 21 23:10:13 EDT 2011 | kemasta

Hi Scott Thank you very much.

BGA failure when chamber test

Electronics Forum | Mon Mar 21 02:41:29 EDT 2011 | kemasta

Hi It's me again. Our products need to pass a chamber test 45c/36hrs after the PCBA completed batch of functional tests and assemble in to case. We found 1 unit was functioning for 24hours in the chamber, but hang after that. We tried to re-boot the

temp stress reliability test for SMT solder bonds

Electronics Forum | Thu Apr 09 12:25:43 EDT 1998 | Dave Hammond

I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whether

Re: temp stress reliability test for SMT solder bonds

Electronics Forum | Thu Apr 09 12:33:43 EDT 1998 | Earl Moon

I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to wheth

Re: temp stress reliability test for SMT solder bonds

Electronics Forum | Thu Apr 09 13:57:33 EDT 1998 | Mike C

I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to wheth

Re: temp stress reliability test for SMT solder bonds

Electronics Forum | Thu Apr 09 14:05:54 EDT 1998 | Earl Moon

I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whe

Re: temp stress reliability test for SMT solder bonds

Electronics Forum | Thu Apr 09 14:02:29 EDT 1998 | Earl Moon

I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whe

Re: temp stress reliability test for SMT solder bonds

Electronics Forum | Fri Apr 10 20:27:07 EDT 1998 | Jean-Paul Clech

I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to wheth

WS flux vs test socket cleaners? --- Similar BUT Different

Electronics Forum | Mon Mar 16 08:44:42 EDT 2015 | davef

The environment of a burn-in chamber is specific. That environment has a fairly well defined affect on the metal contacts of a burn-in socket. Test socket cleaners are tailored for those specific requirements. Look at the MSDS for the WS flux and th

  1 2 3 4 5 6 Next

test chamber searches for Companies, Equipment, Machines, Suppliers & Information