Electronics Forum: tg and fine and pitch (Page 1 of 10)

Solder mask and fine pitch devices

Electronics Forum | Tue Jan 15 10:53:18 EST 2013 | boriskilk

We wouldn't advocate extending the soldermask beyond the component body but yes to ganging for fine pitch. To ensure we don't run into issues with flaking our preference is not to add solder mask when the space between pins is less than 6 mil.

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 18:48:33 EDT 2002 | davef

Fabs can produce a solder mask web between 20 pitch leads, but I've never seen a web for 16 pitch leads. Although, I would like know a supplier that can lay-down a fine web. Minimum solder mask web width is about 0.004 thou. An absolute mininum o

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 10:06:30 EDT 2002 | Bob M

I place 15-20 mil a lot. You need to look at your pad to apature reduction. Your stencil thickness. The type of paste your using. We use 2-5 mil reduction on each side as a general rule on fine pitch. This varies depending on pad width. We also use 5

Solder Paste and fine pitch components

Electronics Forum | Thu Sep 19 12:08:39 EDT 2002 | ccross

I would like to thank everyone for their time and replies

Solder Paste and fine pitch components

Electronics Forum | Tue Sep 17 15:03:33 EDT 2002 | ccross

I am working with fine pitch components (15-20 mil) and having soldering problems and would appreciate some opinions. 1) How much of an effect does pad size have on bridging? 2) How much of an effect does solder paste grain size have? What is the re

Solder mask and fine pitch devices

Electronics Forum | Tue Jan 08 09:23:18 EST 2013 | lock_2002

This is a question regarding soldermask between pins of fine pitch devices. The majority of our production designs end up with at least 2-3 mils of copper thickness on the external layers due to blind vias, wrap plating requirements, etc. Our curre

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 06:53:05 EDT 2002 | CH

1) For solder short, pls check the paste height. Too much vol will cause short. For 15 mils use 5 mils thickness stencil if possible. Check profile preheat time to prevent hot slumpof the paste. 2) type 4 powder will be better for 15 mils pit

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 19:43:12 EDT 2002 | dragonslayr

One more variable I've remembered - pad height with respect to solder mask height. Pads being too low can cause stencil "gasketing" problems that in turn allow more paste to be deposited than needed. Are your fabs HASL or some other media?

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 20:55:33 EDT 2002 | scottefiske

I'm with you dave...please provide specifics as to defect condition... Are you getting good wetting to both land and lead? Is there any repeatability to lead/location/device? Do you have paste inspection capabilites to verify deposition? Is it a Pala

Solder Paste and fine pitch components

Electronics Forum | Fri Sep 20 04:47:29 EDT 2002 | byates

If I were you I would contact your solder paste applications engineer and your stencil applications eng. They are there for this very reason and are very capable

  1 2 3 4 5 6 7 8 9 10 Next

tg and fine and pitch searches for Companies, Equipment, Machines, Suppliers & Information