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Thermal Conductive Insulators

http://orionindustries.com/pdfs/thermal.pdf

. Sil-Pad , Gap Pad, and Q-Pad are registered trademarks of The Bergquist Company. One Orion Park Drive, Ayer, MA 01432 • Phone: 978-772-6000 • Fax: 978-772-0021 • E-mail: info@orionind.com • www.orionindustries.com ORION INDUSTRIES INCORPORATED GAP PADS Material Thickness Range Thermal Conductivity Gap Pad V0 Soft ” thk DIE CUT PARTS ORION is an authorized distributor for Bergquist products. We supply a full line of standard die-cut thermal insulators from any Sil-Pad or Q-Pad material • Puncture resistance Sil-Pad® Materials commonly selected: • Sil-Pad 400 (0.007” thk) • Sil-Pad 2000 (0.010 - 0.060” thk) • Sil-Pad K-10 (0.006” thk) Q-Pad® Materials In some cases, a thermal transfer material does not need to be an electrical insulator . Here, Q-Pad II, and Q-Pad 3 grease replacements excel. Both are high performance materials with thermal resistances much lower than Sil-Pad . Q-Pad II uses an aluminum substrate for maximum thermal conductivity. Q-Pad 3 is a graphite imbedded polymer matrix, with fiber- glass reinforcement to help it maintain its integrity. Gap Pad

http://orionindustries.com/pdfs/silpad.pdf

% reduction in thermal resistance. Sil-Pad 1000 is a composite of silicone rubber and fiberglass. It is specially filled and offers low thermal resistance . In these applications, Sil-Pad 2000 complies with military standards. This silicone elastomer is specially filled to maximize the thermal and dielectric performance of the filler / binder matrix. The result is a “grease-free .08 see SP-R-0022A Specific Gravity 1.5 1.5 1.5 ASTM D 792 Continuous Use Temp., °C -60 to +180 -60 to + 200 -60 to +200 -- Construction Silicone/Fiberglass Silicone/Fiberglass Silicone/Fiberglass Thermal Properties Sil-Pad 1000 Sil-Pad 1500 Sil-Pad 2000 Test Method Thermal Resistance, °C/-in2/W 0.35 0.23 0.2 ASTM D 5470 Thermal Conductivity, W/m-K 1.2 2.0 3.5 ASTM D 5470 Electrical Properties Sil-Pad 1000 Sil-Pad 1500 Sil-Pad 2000 Test Method Breakdown Voltage, Volts a-c Min SIL-PAD 1000 Sil-Pad 1000 has the same excellent mechanical and physical characteristics of our Sil-Pad 400 material while offering a 35

Determining Critical Cleaning Process Parameters for QFNs - ZESTRON Americas

http://www.zestron.com/us/academy/technical-articles/technical-articles-detail.html?tx_news_pi1%5Bnews%5D=262&cHash=f5bd59e69cdc3aee282f68cc7c5b42e9

. The exposed thermal pad included in the package increases heat transfer from the integrated circuit into the PCB. Heat transfer can be further facilitated by metal via the thermal pad . The low standoff associated with such components, typically 1 mil, and the large thermal pad at the center of the component body pose barriers to the complete removal of flux residues

Technical Articles Detail

https://www.zestron.com/us/academy/technical-articles/technical-articles-detail.html?tx_news_pi1%5Bnews%5D=262&cHash=f5bd59e69cdc3aee282f68cc7c5b42e9

. The exposed thermal pad included in the package increases heat transfer from the integrated circuit into the PCB. Heat transfer can be further facilitated by metal via the thermal pad . The low standoff associated with such components, typically 1 mil, and the large thermal pad at the center of the component body pose barriers to the complete removal of flux residues

PCBL - PCB Library Expert

http://www.pcblibraries.com/LibraryExpert/Lite/

& Courtyard to Pad, Toe Heel and Side solder joint goals      - Rules for minimum Pad to Pad, Pad to Thermal, Minimum Solder mask Web, Gang Mask, Minimum Stand-off Pad Trimming, Rounded Rectangular Radius Settings, Thermal Pad Solder & Paste Mask = 115 total families 26 major Through-hole component families and 39 sub-families = 65 total families Preference Options include:      - Terminal Settings for Pad Place Round-off, Solder and Paste Mask, Fabrication and Assembly Tolerances, 3 Density Levels, Courtyard to Body      - Settings for Units, Pin 1 Orientation, Origin Location, Pads on Assembly, Pad Shapes Settings for Mfr. Recommended Footprint patterns Print Package and Footprint data to Printer or PDF Add 8 different Polarity Marking shapes for Silkscreen Legend and Assembly Top in & out, Mirror, Rotate Tools for PADS to CAD, Convert units, Pad Stack and Hole Size Calculator and Axial Lead Form Calculator Help includes 70 videos that describe every feature and a Check for Update

PCB Libraries Forum

http://www.pcblibraries.com/forum/RSS_pcb-libraries-forum.xml

: Nominal Epad vs Max EpadPosted: 26 Nov 2019 at 9:51amSome electronic semiconductors generate more Heat than others. Therefore, the mfr. will recommend a larger thermal pad than nominal .   They also create a PCB with multiple land patterns and run shock, vibration and thermal cycle tests. The last part on the PCB is the land pattern they recommend. Not every mfr −GT3The reasons you list above are a good argument to use nominal values.I find it surprising why manufacturer would recommend EP pad size larger than max : 26 Nov 2019 at 5:35am Tom H wrote:You need to show us a component mfr. datasheet that recommends a maximum pad size. We built 2 million parts for POD and could not find any mfr . using Maximum pad size dimensions. I found a part from On Semiconductor: CAT24C64HU4I−GT3In the datasheet they show a recommended land

Microsoft Word - tip temp

http://www.okinternational.com/File%20Library/Metcal/Resources/White%20Papers/Metcal-Maximum-Tip-Temperature_ver.pdf

Microsoft Word - tip temp SmartHeat® Technology is unique in that it senses the specific thermal demand directly at the solder pad and delivers the precise quantity and flow of thermal energy during both flux activation . Conventional technology senses and responds to the tip temperature and not the thermal energy demand of the solder joint and users are required to calibrate their systems regularly in the hands of the individual operators. Good quality joints are a result of precise quantity and flow of thermal energy and not tip temperature

Microsoft Word - tip temp

https://www.okinternational.com/File%20Library/Metcal/Resources/White%20Papers/Metcal-Maximum-Tip-Temperature_ver.pdf

Microsoft Word - tip temp SmartHeat® Technology is unique in that it senses the specific thermal demand directly at the solder pad and delivers the precise quantity and flow of thermal energy during both flux activation . Conventional technology senses and responds to the tip temperature and not the thermal energy demand of the solder joint and users are required to calibrate their systems regularly in the hands of the individual operators. Good quality joints are a result of precise quantity and flow of thermal energy and not tip temperature

Dispensing Needle Cleaning

http://www.gpd-global.com/co_website/features-needlecleaner-max2.php

& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER . The nozzle moves incrementally along pad length to avoid nozzle contamination. System notifies operator when needle reaches end of its pad length. 1 . Automatic Nozzle Cleaning. Wipe Styles Needle Cleaner tool-less design makes changing wipes very easy. Simply remove magnetic pad holders, remove old pads, and insert new ones . Multiple styles of wipes (pad, paper) are available. Pad style needed depends on type of fluid to be cleaned. Multi-wipe Pad Absorbent Paper Wipe Vacuum Nozzle Clean/Purge Vacuum Nozzle Clean/Purge is recommended for NCM5000 Jetting pump & Recorder FullView Illumination 2X Lens Extender High Depth of Field Lends - THERMAL - Pre-Heat Post-Heat Thermal Imaging System Heated Body Pump Heated Syringe - OTHER - Real Time Process Control (FPC

Dispensing Needle Cleaning

http://www.gpd-global.com/co_website/features-needlecleaner.php

& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER . The nozzle moves incrementally along pad length to avoid nozzle contamination. System notifies operator when needle reaches end of its pad length. 1 . Automatic Nozzle Cleaning. Wipe Styles Needle Cleaner tool-less design makes changing wipes very easy. Simply remove magnetic pad holders, remove old pads, and insert new ones . Multiple styles of wipes (pad, paper) are available. Pad style needed depends on type of fluid to be cleaned. Multi-wipe Pad Absorbent Paper Wipe Vacuum Nozzle Clean/Purge Vacuum Nozzle Clean/Purge is recommended for NCM5000 Jetting pump & Recorder FullView Illumination 2X Lens Extender High Depth of Field Lends - THERMAL - Pre-Heat Work Area Heat Post-Heat Thermal Imaging System Heated Body Pump Heated Syringe - OTHER - Real Time Process Control (FPC

International Conference for Electronics Hardware Enabling Technologies

https://www.smta.org/icehet/workshops.cfm

: QFN Package Background IPC-7093 Standard Pad Design Impacts/Influences QFN Thermal Pad Voiding Manufacturing Implementation         - Stenciling         - Reflow         - Cleaning Solder Joint Reliability         - Thermal Cycle         - Drop Shock         - Vibration Who should attend? This workshop presents an overview of failure analysis techniques for design engineers, component engineers, and quality engineers who may not be familiar with the physics behind FA tools available . PDC3: Thermal Management Basics Rita Mohanty, Ph.D., Henkel Course Overview: Electronics industry continue to move towards highly integrated devices with smaller feature sizes and higher currents to meet the demand of consumers for higher functionality with smaller footprint devices . Higher functionality comes with the price of high heat generation due to higher power dissipation. Design engineers must consider appropriate thermal management approach to meet today’s stringent requirements for device reliability. This course is structured to give the design engineers an overview of fundamentals of passive thermal management using Thermal Interface Materials (TIM). Topics Included

Call for Papers | SMTA International

https://www.smta.org/smtai/call_for_papers.cfm

-Computed Tomography Multiphysics Modeling Substrates and Finishes Thermal Management Tin Whiskers PCB Technology: Bio-Compatible Substrates Black Pad and Surface Finish Defects Conductive Anodic Filament (CAF , & Electronics New Materials and Processes Optoelectronics Plastic 3D PCB to PCB Technology Power or Thermal Management Power Electronics Printed Electronics Technology Reliability of Nanodevices Resin Reinforcement Solder Pastes Sensors and Manufacturing Smart Manufacturing Systems Small Die Size Singulation Solid State Lighting Solar Technology System in a Package Thermal Interface Materials Touch & Solderability Pad Cratering Soldermask Substrate Reliability Process Control: Acoustic Imaging (C-SAM) Bene-ts of AOI & SPI CIM In-Circuit Test Process Modeling Software Test Strategies 2D/3D X-Ray Thanks and the SMTAI Technical Committee looks forward to hearing from you

Failure Analysis Techniques for Electronics (Paperback)

https://store.aciusa.org/Failure-Analysis-Techniques-for-Electronics-Paperback-P171.aspx

are: Imaging Cleanliness testing Solderability testing Spectroscopic analysis Thermal analysis Wire bond mechanical testing Non-destructive testing Counterfeit component screening Solder analysis Environmental stress screening Case studies are provided in the areas of:  Head-on-pillow Solder voiding Pad cratering Surface finish issues Porous or thin gold over nickel Black pad Gold embrittlement Corrosion products Full color images and data are provided, as well

EMPF RB0009 - Solder Joint Volume Calculation Using a Spreadsheet (June 1993)

https://store.aciusa.org/EMPF-RB0009-Solder-Joint-Volume-Calculation-Using-a-Spreadsheet-June-1993--P107.aspx

: Lead Thickness Inside Lead Radius Length of Lead Foot Lead Width Pad Width Toe Angle Toe Elevation Above Pad Height of the Heel Solder Fillet Reviews Be the first to submit a review on this product + Add to Cart EMPF RB0010 - Stencil Printing Fine-Pitch Applications (May 1993) Price: $0.00 + Add to Cart EMPF RB0005 - Computer Thermal Modeling of a Convective IR Reflow Oven (November 1992) Price: $0.00

1913 Mark III Series Drawing

http://www.hellerindustries.com/search.php?zoom_query=1913+Mark+III+Series+Drawing&zoom_page=8&zoom_per_page=10&zoom_and=0&zoom_sort=0

. The solder joint has a pad impression where it a scanning electron microscope (SEM) but the speed of made electrical contact before the thermal cycle induced making the CT model is measured in minutes compared stresses caused failure : IPC-JSTD-001 maximum void size criteria. Thermal Fatigue Experiments and Alloy Test Requirements," X-ray and metallographic inspections showed that Proceedings of SMTAI, 317-324, San Diego CA, 2009 ... , 0603, 0402 HASL SnPb over powder, No-clean flux all 100% Sn finish Cu pad The test vehicle designed is shown in Figure 1. It is a single layer board with the board thickness of 62 mils (1.57 mm . A Heller 1500 convection oven with 5 heating zones and one cooling zone was used for solder reflow. The 18 reflow profiles were developed using three thermal couples attached to the test vehicle where covered the diagonal corners of the ... 5 Jul 2016   -   URL: http://www.hellerindustries.com/pan_APEX06 .pdf The Last Will And Testament of the BGA Void ... component pad resolution of the CT is not at the same level as that found in location

The Last Will And Testament of the BGA Void

http://www.hellerindustries.com/last-will-of-bga-void.pdf

. Study #6: J. Smetana, et al, “The Effects of Non-filled Microvia in Pad on Pbfree Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal Cycling” [10 ) resulted in significantly more voids in BGA/CSP solder joints than no Via in Pad design  The voiding percentage in area or diameter of the BGA solder joints did not correlate to the failure cycle in thermal cycling (Figure 7) Figure 7. Scatter Chart Showing justifies its removal from the investigation data set for assignable cause. Figure 29 and Figure 30 illustrate the defective U1 component pad location. The solder joint has a pad impression where it made electrical contact before the thermal cycle induced Location on BGA Thermal Fatigue Life”, SMTAI Conference Proceedings, 2010 10. J. Smetana, et al, “The Effects of Non-filled Microvia in Pad on Pbfree Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal Cycling”, IPC APEX Conference . These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C

The Last Will And Testament of the BGA Void

http://www.hellerindustries.com.cn/last-will-of-bga-void.pdf

. Study #6: J. Smetana, et al, “The Effects of Non-filled Microvia in Pad on Pbfree Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal Cycling” [10 ) resulted in significantly more voids in BGA/CSP solder joints than no Via in Pad design  The voiding percentage in area or diameter of the BGA solder joints did not correlate to the failure cycle in thermal cycling (Figure 7) Figure 7. Scatter Chart Showing justifies its removal from the investigation data set for assignable cause. Figure 29 and Figure 30 illustrate the defective U1 component pad location. The solder joint has a pad impression where it made electrical contact before the thermal cycle induced Location on BGA Thermal Fatigue Life”, SMTAI Conference Proceedings, 2010 10. J. Smetana, et al, “The Effects of Non-filled Microvia in Pad on Pbfree Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal Cycling”, IPC APEX Conference . These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C

Microsoft Word - pan_APEX06.doc

http://www.hellerindustries.com.cn/pan_APEX06.pdf

. Solder paste needs adequate reflow temperature to melt, wet, and interact with the copper pad or other board metallization and component metallization to form the solder joint ). For SnAgCu reflow soldering, a commonly accepted minimum peak temperature of 230°C is necessary to achieve acceptable solder joints. The maximum temperature, on the other hand, depends on the board size, board thickness, component configuration, material thermal mass, oven capability, and etc (Note that in SnPb solder joint, Cu6Sn5 present at the interface between SnPb solder and the Cu pad) and Ag3Cu intermetallic compound (IMC % Sn finish OSP over Cu pad Sn63Pb37, Type 3 powder, No-clean flux 1206, 0805, 0603, 0402 all 100% Sn finish HASL SnPb over Cu pad The test vehicle designed is shown in Figure 1 . The 18 reflow profiles were developed using three thermal couples attached to the test vehicle where covered the diagonal corners of the board and the center

BGA Rework Training and Certification – Precision PCB Services, Inc.

https://precision-pcb-services-inc.com/products/bga-rework-training

: A review of the parameters for establishing a safe thermal profile. Circuit board preparation - masking, baking and other process steps . BGA Re-Balling BGA pad Repair Flux Considerations for BGA's, LGA's and QFN's. Solder Paste Considerations for Fine Pitch Devices  to the Lead Free Process. Identify and resolve defect anomalies related to Surface Finish, i.e..  "Black Pad". And Much more! Price for this 3-day class at our Oroville facility is $1000.00 per student

HeatShieldGel

http://www.soldertools.net/heatshield-gel-16-oz-jar/

™ Preform Engineer My Pattern Training Materials All Training Materials Standards and Documents Solder Training Kits PCB Repair Materials All PCB Repair Materials PCB Repair Inst'n Manual Pad Repair ™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic components . It is truly a revolutionary means to protect components. It keeps components from being exposed to full reflow cycle temperatures, thereby reducing their potential thermal damage ™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic components ™ Preform Engineer My Pattern Training Materials All Training Materials Standards and Documents Solder Training Kits PCB Repair Materials All PCB Repair Materials PCB Repair Inst'n Manual Pad Repair

IPC J-STD-001GS Space Addendum (Revision G - Space) - BEST Inc Store

http://www.soldertools.net/ipc-j-std-001gs-space-addendum-revision-g-space/

™ Preform Engineer My Pattern Training Materials All Training Materials Standards and Documents Solder Training Kits PCB Repair Materials All PCB Repair Materials PCB Repair Inst'n Manual Pad Repair for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications.   Number of Pages: 28 ISBN ™ Preform Engineer My Pattern Training Materials All Training Materials Standards and Documents Solder Training Kits PCB Repair Materials All PCB Repair Materials PCB Repair Inst'n Manual Pad Repair

Tenting Via - The Ultimate Guide To The Importance of PCBs

https://www.ourpcb.com/tenting-via.html

. Our discussion will cover the various processes used to fill vias and the advantages associated with each of them. What is Tenting Via Solder-Filled Vias Better PCBs in Eagle Vias Not Covered Via in Pad Via Plugging Conclusion   1 . Some surface mounted devices on a PCB can produce excessive heat which needs to be conducted away for proper functioning. For this reason, thermal vias are often plugged with conductive fills . Copper increases the thermal conductivity of the board carrying heat away from sensitive PCB components dissipating to the other side of the board . The process leads to one drawback- there is a difference in Coefficient of Thermal Expansion (CTE) between the conductive fill and the surrounding laminate . The via walls and pads can break in-between as the metallic fill expands more quickly than the surrounding laminate. For this reason, this process is not suitable for some applications such as Via in Pad where the filling is done to ensure the durability of the copper plating covering the hole

HDI PCB - The Ultimate Guide To How To Achieve An Ideal PCB

https://www.ourpcb.com/hdi-pcb.html

. Furthermore, it allows for faster and more efficient transmission of data due to the shortening of the paths. Image 1: HDI PCB You can easily distinguish them through the micro-vias, finer lines, thin materials as well as a higher pad density . However, you have to choose between the different types. These include the near pad or the via in pad versions. Thus, it is imperative you choose one that costs you or your CM the least to manufacture without compromising on the electrical performance of the HDI PCB. Tip No. 3 . They allow for innovation and miniaturization of products. All in all, they pose the following benefits: Less Thermal Stress Because the components are closer together in an HDI PCB, the heat . It ensures lesser thermal stress and adds to the durability of the PCB. Better Conductivity The HDI PCB helps in ensuring better conductivity due to a large number of micro vias . These are filled with conductive materials that allow for easier transmission. Furthermore, these vias, whether they are blind or via-in-pad ones, allow components to be placed very close to each other

Call for Papers | SMTA International

http://smta.org/smtai/call_for_papers.cfm

-Computed Tomography Multiphysics Modeling Substrates and Finishes Thermal Management Tin Whiskers PCB Technology: Bio-Compatible Substrates Black Pad and Surface Finish Defects Conductive Anodic Filament (CAF , & Electronics New Materials and Processes Optoelectronics Plastic 3D PCB to PCB Technology Power or Thermal Management Power Electronics Printed Electronics Technology Reliability of Nanodevices Resin Reinforcement Solder Pastes Sensors and Manufacturing Smart Manufacturing Systems Small Die Size Singulation Solid State Lighting Solar Technology System in a Package Thermal Interface Materials Touch & Solderability Pad Cratering Soldermask Substrate Reliability Process Control: Acoustic Imaging (C-SAM) Bene-ts of AOI & SPI CIM In-Circuit Test Process Modeling Software Test Strategies 2D/3D X-Ray Thanks and the SMTAI Technical Committee looks forward to hearing from you

Technical Sessions | SMTA International

http://smta.org/smtai/tech.cfm

: Richard Coyle, Ph.D., Alcatel-Lucent Co-Chair: Keith Sweatman, Nihon Superior Co., Ltd. Monday, September 28 | 9:00am - 10:30am Near-eutectic, high Ag SAC305 solder is the accepted choice for most electronic assembly applications, but some concerns have been raised over the performance of SAC305 in harsh thermal cycling . Application needs, field use simulation conditions, and resulting failure analysis will be discussed. Thermal Shock Reliability Test on Multiple Doped Low Creep Lead Free Solder Paste and Solder Ball Grid Array Packages Anto Raj, Sivasubramanian Thirugnanasambandam, Thomas Sanders, Sharath Sridhar, John Evans, Ph.D , defense and telecommunication electronic products are far more stringent than other industries. This session will describe newly developed solder alloys, solder pastes and evaluate promising thermal pastes for use in harsh environments prevalent for these industries. Assessment of Thermal Pastes for Use in Space Electronics Jeff Jennings, Susan M. Marlowe and Peter F. Ruggiero, Harris Corporation Novel Lead-Free Solder Alloys Development for Automotive Applications Weiping Liu, Ph.D., *Ning-Cheng Lee, Ph.D . Solder-Joint Reliability of 0.8mm BGA Packages for Automotive Applications Burton Carpenter, Freescale Semiconductor Inc. and Thomas Koschmieder, Cirrus Logic, Inc. Board, Package and Die Thickness Effects Under Thermal Cycling Conditions Jean-Paul Clech

http://www.smta.org/files/SMTAI.PDF

http://seikausa.com/sites/default/files/product/mcdry/msd-storage-technical-article.pdf

.” Surface peeling between the die pad and the resin is caused by water vapor pressure during reflow. Surface delamination is likely, resulting in shear strain on bond wires and wire necking . Components are comprised of dies normally made of silicon, a die pad made from 42 alloy and various plastic materials which make up the body of the component . The materials that comprise a component have different thermal expansion ratios, adhesive strength and material strength characteristics. Thus, as illustrated Figure 1 above, moisture absorbed by components vaporize during the reflow process ] : Component cracking External cracking may appear on the side, top and bottom side of components. As the package wall is often thinnest below the die pad bottom side cracking is the most common and very difficult to detect visually moisture from the atmosphere. At first the plastic packaging absorbs the moisture and it slowly spreads to the chip and die pad. Moisture that reaches the die pad expands rapidly during the reflow process causing delamination and package cracking

empfasis

http://seikausa.com/sites/default/files/product/mcdry/empf-asis-may-2001.pdf

areas. Upon reflow, tin-copper or tin- nickel intermetallic structures form between the solder, lead, and pad. If the solder joint is subjected to extended peri- ods of time at high temperatures, the tin and copper or tin and nickel continue enbrittled by expo- sure to heat. The tin-rich and lead-rich regions of the solder also experience growth when exposed to high tempera- tures for some extended period of time. The growth of these regions can be accelerated by thermal or mechanical stress weakens the joint and is a primary indicator of thermal or ther- mo-mechanical fatigue. Often cracks that form in tin-lead solder joints after thermal cycling occur in the lead-rich coarsened grains near the interfaces. Tin-based lead-free alloys exhibit forces (40%) and thermal hot spots generated between wire bonds. The application of the AlN ThinPak packaging also contributes to improved thermal performance through reduced device operating temperatures. As a result, devices can be placed closer together to improve power densi- ty and reduce thermal stresses by decreasing thermal expan- sion strain. Using the ThinPak technology will allow the transfer of the high power semiconductors to the commercial industry for incorporation into appropriate power systems

SnAgCu_NC601_TDS.pdf

http://qualitek.com/wp-content/uploads/2017/06/nc601_snagcu_tds.pdf

,% 27 48 Coefficient of Thermal Expansion Pure Sn= 23.5 24.7 Joint Shear Strength, at 0.1mm/min 20 C 27 23 Tensile Strength, psi 4312 4442 Joint Shear Strength at 0.1mm/min 100 C 5 1 Electrical Conductivity, %IACS 16.6 11.9 Thermal Conductivity, W/m.K 58.7 50.9 Wire Diameter SnAgCu alloy wire is available in a variety of diameters . The chosen diameter is based on application methods, pad size, and desired solder joint volume. Generally, the diameter of the wire should be slightly larger than the width/diameter of the joint or connection to be soldered

http://qualitek.com/wp-content/uploads/2017/06/NC611_sac_tds.pdf

. The chosen diameter is based on application methods, pad size, and desired solder joint volume. Generally, the diameter of the wire should be slightly larger than the width/diameter of the joint or connection to be soldered , °C 217-221 183 E Yield Strength, psi 3724 3950 Hardness, Brinell 15HB 14HB Total Elongation,% 27 48 Coefficient of Thermal Expansion Pure Sn= 23.5 , %IACS 16.6 11.9 Thermal Conductivity, W/m.K 58.7 50.9 Flux Residues & Cleaning NC611 is a no clean formulation; therefore, residue removal is not required for typical applications

Soldering Aids and Soldering Aid Kits

http://www.beautech.com/bt_full_line.pdf

, and thermal properties for applications on printed circuit boards. Beau Tech spudgers have many advantages compared with nylon/fiberglass spudgers ° mirror-handle angle allows inspection of hard-to-see places. Made of over 300 long, fine, stainless steel bristles. Use to clean flux from solder joints, clean flux and adhesive from solder pad, and for general cleaning purposes . Stainless Steel Brush • Over 300 long, fine, stainless steel bristles. • Use to clean flux from solder joint. • Use to clean flux and adhesive from solder pad . • Use to clean pad surfaces before soldering. • Use to cut and remove traces. Hook • Use the strong and sharp point for punching and cleaning holes

Soldering Aids and Soldering Aid Kits

https://www.beautech.com/bt_full_line.pdf

, and thermal properties for applications on printed circuit boards. Beau Tech spudgers have many advantages compared with nylon/fiberglass spudgers ° mirror-handle angle allows inspection of hard-to-see places. Made of over 300 long, fine, stainless steel bristles. Use to clean flux from solder joints, clean flux and adhesive from solder pad, and for general cleaning purposes . Stainless Steel Brush • Over 300 long, fine, stainless steel bristles. • Use to clean flux from solder joint. • Use to clean flux and adhesive from solder pad . • Use to clean pad surfaces before soldering. • Use to cut and remove traces. Hook • Use the strong and sharp point for punching and cleaning holes

JUKI Carry PWB E8617721AA0 Carry PCB A ASM 4 - MOTOR KE750 Conveyor PCB Board Assembly

http://www.smtspare-parts.com/sale-11658404-juki-carry-pwb-e8617721aa0-carry-pcb-a-asm-4-motor-ke750-conveyor-pcb-board-assembly.html

S E8741725BB0 S E8741725CB0 S E8760452L00 TUBE 9 E8760452N00 TUBE 11 E8760452R00 SUMI TUBE (THERMAL CONTRACTION E90027230A0 CONFIRMATION RAMP ASM E90037230A0 SUPPORT BUTTON ASM E90067230A0 LOWER LIMIT SENSOR ASM E90087230A0 FEEDER CONNECTOR CABLE ASM E90097230A0 CYLIDER SWITCH SAM . E91137230A0 SPAD/BGA SENSOR R CABLE ASM E91147230A0 SPAD/BGA SENSOR CABLE ASM E91157230A0 S SENSOR CABLE ASM E91187230A0 PAD R CHANGE SV CABLE ASM E91197230A0 PAD L CHANGE SV CABLE ASM E91207230A0

JUKI Carry PWB E8617721AA0 Carry PCB A ASM 4 - MOTOR KE750 Conveyor PCB Board Assembly

http://www.smtspare-parts.com/sale-11658404-juki-carry-pwb-e8617721aa0-carry-pcb-a-asm-4-motor-ke750-conveyor-pcb.html

S E8741725BB0 S E8741725CB0 S E8760452L00 TUBE 9 E8760452N00 TUBE 11 E8760452R00 SUMI TUBE (THERMAL CONTRACTION E90027230A0 CONFIRMATION RAMP ASM E90037230A0 SUPPORT BUTTON ASM E90067230A0 LOWER LIMIT SENSOR ASM E90087230A0 FEEDER CONNECTOR CABLE ASM E90097230A0 CYLIDER SWITCH SAM . E91137230A0 SPAD/BGA SENSOR R CABLE ASM E91147230A0 SPAD/BGA SENSOR CABLE ASM E91157230A0 S SENSOR CABLE ASM E91187230A0 PAD R CHANGE SV CABLE ASM E91197230A0 PAD L CHANGE SV CABLE ASM E91207230A0

Air-Vac Engineering DRS 24C

http://ce-exchange.com/detail/air-vac-engineering-drs24c-rework-station-4038.cfm

.     > Auto Adjustment Capability: In-process adjustment of force value (± range)      Thermal Profiling   > Thermocouple Channels: 8 high speed K type thermocouple channels for profiling and process analysis.  Self calibrating. Resolution of 0.15 degrees C/res. bit .    > Thermal SMART TRACK Software Management: Automatic thermal profiling software with profile optimization build function.   IR Temperature Probe (on top of each other). > LED sensor for height reference and polarizing filter for (pad) contrast adjustment     Illumination   Green/White LED’s: Software controlled, independently adjustable vision lighting intensity provides enhanced optical contrast during alignment

Air-Vac Engineering DRS 24C

http://ce-exchange.com/detail/air-vac-engineering-drs24c-rework-station-5594.cfm

.     > Auto Adjustment Capability: In-process adjustment of force value (± range)      Thermal Profiling   > Thermocouple Channels: 8 high speed K type thermocouple channels for profiling and process analysis.  Self calibrating. Resolution of 0.15 degrees C/res. bit .    > Thermal SMART TRACK Software Management: Automatic thermal profiling software with profile optimization build function.   IR Temperature Probe (on top of each other). > LED sensor for height reference and polarizing filter for (pad) contrast adjustment     Illumination   Green/White LED’s: Software controlled, independently adjustable vision lighting intensity provides enhanced optical contrast during alignment

IPC Members Only

http://ipc.org/html/IPC-online-presentation-library.htm

: A Spectrum Solution to Electrical and Thermal Conduction in the Z-Axis Presentation by Catherine Shearer, Senior Scientist, Ormet Circuits Inc Compatable Assembly, Microstructure and Thermal Reliability on an Extremely Large Ball Grid Array " Presentation by Raiyo Aspandiar of Intel Corporation This presentation was recorded live in San Diego, California during the Technical Conference at IPC APEX at the IPC Technology Interchange on Thermal Management, November 3-4, 2010 " New Materials and Their Impact on Thermal Management: Solder Mask " Presentation by David Vaughan of Taiyo America This presentation was recorded live in Irvine, California at the IPC Technology Interchange on Thermal Management, November 3-4, 2010 " Thermal Management for LED Applications " Presentation by Yash Sutariya of Saturn Electronics Corporation This presentation was recorded live in Irvine, California at the IPC Technology Interchange on Thermal Management, November 3-4, 2010 " Polymide Based Materials for Electronic Applications " Presentation by Tom Lantzer of DuPont Circuit and Packaging Materials This presentation was recorded live in Palm Springs, California

Document Revision Table | IPC

http://ipc.org/4.0_Knowledge/4.1_Standards/revstat1.htm

Appendix D    Orig. 10/96   IPC-TR-468 Factors Affecting Insulation Resistance Performance of Printed Boards    Orig. 3/79   IPC-TR-470 Thermal Characteristics of Multilayer Interconnection Boards    Orig. 1/74   IPC-TR-474 An Overview of Discrete Wiring   IPC-TR-485 Results of Cooper Foil Rupture Strength Test Round Robin Study    Orig. 3/85   IPC-TR-486 Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence , Thermal Stress, Convection Reflow Assembly Simulation D-32 Orig. 12/10   IPC-9641 High Temperature Printed Board Flatness Guideline 6-11 Orig. 6/13   IPC-9691 User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection 6-10d Orig. 1/14   IPC/JEDEC-9707 Spherical Bend Test Method for Characterization of Board Level Interconnects 6-10d Orig. 9/11   IPC-9708 Test Methods for Characterization of Printed Board Assembly Pad Cratering 6-10d Orig. 12/10   IPC-9709 Test Guidelines for Acoustic Emission Measurement during Mechanical Test 6-10d Orig. 12/13   IPC-9850 Surface Mount Equipment Performance

BGA Rework Training and Certification – Precision PCB Services, Inc.

https://precision-pcb-services-inc.myshopify.com/products/bga-rework-training

: A review of the parameters for establishing a safe thermal profile. Circuit board preparation - masking, baking and other process steps . BGA Re-Balling BGA pad Repair Flux Considerations for BGA's, LGA's and QFN's. Solder Paste Considerations for Fine Pitch Devices  to the Lead Free Process. Identify and resolve defect anomalies related to Surface Finish, i.e..  "Black Pad". And Much more! Price for this 3-day class at our Oroville facility is $1000.00 per student

Layout 1

http://islandsmt.com/wp-content/uploads/2017/02/ONYX29-Literature081.pdf

-eng.com Powerful, Closed-Loop Process Heating BOTTOM HEATER Thermally balanced heating elements provide ultra-fast heat up with excellent thermal uniformity . Black ceramic, high-emissive coating dramatically increas- es radiant energy, provid- ing the capability to pre- heat high thermal mass and lead free boards to the sig- nificantly higher preheat temperature (140C ) required for lead-free rework. Uniform, overall heating minimizes PCB warpage and localized thermal stress of upper heating. Closed-loop board temperature sensor monitors and trig- gers board preheat to target temperature regardless of machine or board thermal conditions . Extraordinary Software Capabilities • Simple, fast and easy first run, automatic thermal pro- filing with on-the-fly adjust- ments. Removal, site clean- ing and replacement pro- grams are automatically built and immediately ready to run . • Automatic process sequences with site pad cleaning x, y and z motion of programmed pattern. • Advanced motion, heating and peripheral routines may be added to any program sequence

Infinity Engineering Specification Manual

http://islandsmt.com/wp-content/uploads/2017/02/DEK-Infinity-Engineering-Spec.pdf

Intregrated Thermal Control 2D Inspection Full inspection capabilityof screen and board: Basic Advanced Automatically triggered recovery sequences Inspection outputs available to Statistical Process Control software Tooling Magnetic Pillars Form-Flex AutoFlex programmable tooling (11 & 35mm pitch . Magnetic/thermal over current protectors protect the machines’ internal wiring and components from overheating/fire during fault conditions : • Stencil Blockage - solder paste remaining inside stencil apertures. • Stencil Smear - solder paste on the stencil. • Board: Paste Present - amount of the pad covered by solder paste, as a % of the aperture size. • Board: Alignment - accuracy of paste positioning compared to the learnt site image. • Board: Bridging - distance between adjacent deposits of paste. Paste Volume Prediction Using stencil aperture, blockage and paste present information the system can calculate the volume of paste on the pad Advanced Board Paste on Pad Basic + Bridging and Alignment Stencil Blockage Basic + Smear 22 Engineering Specification Chapter Issue 1 May 00 INFINITY ENGINEERING SPECIFICATION MACHINE OPTIONS Stencil Inspection The vision system carries out various stencil

APEXFinalPiracci.PDF

http://www.nordson.com/en-us/divisions/asymtek/Documents/Papers/2000-03%20Jetting%20production_APEX_NordsonASYMTEK.pdf

. SMA can also provide the added benefits of mechanical strength, thermal conductivity, dielectric strength and chemical inertness throughout the life of the assembly. FIGURE 1 when using a mechanical standoff. The process engineer must predict which orientation of the standoff to the needle will not land on a trace, pad or previously dispensed adhesive dot. This challenge becomes even more difficult when multiple PCBs

Practical Production Applications for Non-Contact Dispensing Technology

http://www.nordson.com/en-us/divisions/asymtek/Documents/Papers/2000-09%20Non-contact%20dispensing%20SMTA%20ATE%202000%20NordsonASYMTEK.pdf

. SMA can also provide the added benefits of mechanical strength, thermal conductivity, dielectric strength and chemical inertness throughout the life of the assembly of variability. Figure 7 identifies reasons why the landing area for the standoff must be considered when using a mechanical standoff. The process engineer must predict which orientation of the standoff to the needle will not land on a trace, pad or previously

http://www.ipcapexexpo.org/files/IPC-APEX-EXPO-2017-Brochure.pdf

PROMATION Prototron Circuits PUREX INC. PVA Q1 Test Inc. QA Technology Company, Inc. Qualitek International, Inc. Quantum Silicones Quasys AG Quik-Tool, LLC. QxQ, Inc. RBP Chemical Technology Real Time with...IPC Rehm Thermal Systems Rogers Corporation SAKI Moderator: Jason Keeping, Celestica S24 | CONFORMAL COATING Wednesday | February 15 | 3:30 pm-4:30 pm Moderator: Jason Keeping, Celestica S25 | PCB RELIABILITY - PAD CRATERING Wednesday | February 15 | 3:30 pm-4:30 pm Moderator: Bhanu Sood, NASA Goddard Space | February 15 5-22H THERMAL PROFILING GUIDE TASK GROUP Tuesday | February 14 5-22K BOTTOM TERMINATION COMPONENTS TEST METHODS TASK GROUP Monday | February 13 5-22PT PROCESS ENGINEERING PROGRAM TECHNICAL TRAINING COMMITTEE Thursday | February 16 5-23A PRINTED | February 13 RIGID PRINTED BOARDS 7-31A/D-33A JOINT MEETING - IPC-A-600 AND IPC-6012 TASK GROUPS Sunday | February 12 D-32 THERMAL STRESS TEST METHODOLOGY SUBCOMMITTEE Tuesday | February 14 D-33AM IPC-6012 MEDICAL DEVICE ADDENDUM TASK GROUP Monday | February

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IPC Training & Certification - Blackfox

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