Electronics Forum: thermal pad (Page 11 of 49)

Re: 0603's on 0805 pads

Electronics Forum | Mon Aug 28 18:57:41 EDT 2000 | Earl Moon

Steve, This is a good, well repeated, not identified by IPC yet issue. I, and some others in industry, for years have proven and recommended smaller pads for various devices. I, and some others in industry, use 0402 pads for 0603 device types. IPC o

QFN PCB Pad no Drain Hole

Electronics Forum | Wed May 22 19:10:47 EDT 2013 | anvil1021

We do a lot of these devices and I guess I am not familiar the term "Dry Solder". The QFN device is not designed to have a drain hole, but needs to have thermal vias to control heat in most cases. We have used every possible gnd pad design and modifi

Voids in grounding pad of RF PCB

Electronics Forum | Fri Aug 02 12:07:50 EDT 2002 | johnw

Richard, your asking a multi million dollar question that in my own opinion no one can give you the right answer since no one really knows. hence I think the lack of answers to your question....thought there would be more people willing to propose a

Re: Through holes in SMT pads

Electronics Forum | Thu Jul 08 15:38:27 EDT 1999 | Earl Moon

Thank you all for your replies. Thanks to your replies and backup from the IPC-SM-782A (section 3.6.3.2) and James Blankenhorn's "SMT Design Rules & Standards," the designer has agreed to provide adequate clearance between the via and the pad.

uBGA Square Pads or Lands

Electronics Forum | Fri Jul 16 14:05:04 EDT 1999 | Jim Blankenhorn

Hi all , We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: 1. Is underfill required for micro-BGAs? 2. What type of stencil apertures are t

Reflow soldering lead onto much larger pad

Electronics Forum | Mon Dec 07 14:55:41 EST 2015 | clydestrum

So I have an issue coming up that I'm not too sure how to handle. A board was designed with the wrong footprint for a 3-lead transistor in which the single-lead side has a much larger (think thermal pad for qfn) copper land than what is meant for the

Chip Components with big ground pads - Unsolder

Electronics Forum | Wed Jan 28 20:58:16 EST 2004 | davef

Vinny: From a thermal standpoint, your choices are: * Get your customer to design thermal relief in the board. * Set your thermal recipe to assure that the grounded pad reaches reflow temperature. This may require a long soak at a single temperature

Importance of Exposed Pad In ST QFP for Set top box product

Electronics Forum | Thu Oct 01 08:34:50 EDT 2009 | davef

First, the reflow thermal recipe provided by your paste supplier is only a ball park guess. Beyond that, the temperature measured by thermocouples on your oven heaters are only loosely related the temperature of solder paste on your board. You need t

Chip Components with big ground pads - Unsolder

Electronics Forum | Thu Jan 29 06:58:40 EST 2004 | davef

Ramp / Soak: Tombstoning is occuring during reflow. You need to get more heat into the ground plane. Obviously a ramp aint gettin' it done. Further, without intending to disrespect your internal discussion, if a linear profile improved the situati

QFN84 Solder Printing Issue (QFN with Inner LGA Pad)

Electronics Forum | Sat Dec 02 10:23:47 EST 2017 | tomh

Have you ever heard of "Solder Mask Defined Thermal Pads"? I wrote a short blurb on this here - https://www.pcblibraries.com/forum/ipc7093a-btc-qfn-solder-mask-defined-thermal-pad_topic2154.html This technology saves fabrication costs by not havi


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