Electronics Forum: thermal pad (Page 15 of 49)

SMD module moving during reflow

Electronics Forum | Mon Jun 24 10:19:23 EDT 2019 | slthomas

I have not added images in quite some time but the "Attachments" feature below the window where you type your post will steer you through it. You just have to have the image hosted someplace that you can point to. Just for

Gold Surface Finish on PCB's

Electronics Forum | Wed Dec 14 08:58:27 EST 2005 | russ

We experienced brittle solder joints that did not withstand thermal cycling as I was told. I am positive about the fractured joints but was informed by customer that it was thermal cycling of the part when they failed so they were latent failures.

Aluminum Capacitor disassociated from sodler joint

Electronics Forum | Tue Feb 19 10:47:47 EST 2019 | rgduval

I'm with Steve. Check the datasheet, and make sure that the terminations are meant for solder application, and not conductive epoxy. I had that happen a year or so ago with an MLCC. Drove us nuts for two days (not to mention the significant rework

Tombstone components issue after reflow?

Electronics Forum | Mon Aug 14 03:25:51 EDT 2017 | spoiltforchoice

There is no solution in above case, this is > caused by the PCB design. There are no > thermals on the pads connected to the copper > poured area. So the other pad reflow first and > lift the component. Yes, this. You could try playing with

BGA Rework - Pads being lifted

Electronics Forum | Sat Apr 04 08:35:27 EDT 2009 | davef

Cause: Solder between the pad and the BGA on the pads being lifted has not melted. So, when you lift the BGA, you also lift those pads with the unmelted solder with the BGA. These pads are probably sinking the heat to a large copper plane in a inner


Electronics Forum | Sat Jul 21 09:27:45 EDT 2001 | davef

No. There's nothing fancy. You need enough solder on the exposed pad for a good thermal connection, but not so much to lift the comonent off the TSSOP pads. We reduce the aperture for the pad, dunno 85%, with four windows [but it doesn't matter ho

Re: High Tg laminates

Electronics Forum | Wed Nov 17 09:02:57 EST 1999 | Dave F

John: The 180 Tg point is a sweet spot for obtaining heat resistance, cost effectivly. These high technology boards provide good thermal resistance for wire bonding, direct chip attach, and BGA mounting and rework. Since these boards are harder th

QFP Coplanarity & Alloy 42

Electronics Forum | Wed Oct 01 15:06:50 EDT 2003 | davef

You're thinking correctly. Concentrate your recipe development efforts by profiling directly on the pads [that some fine designer forgot to thermally isolate properly] of those pesky corner leads that don't solder well.

QFN (9x9) Thermal Capacitance Model

Electronics Forum | Tue Dec 28 03:54:50 EST 2010 | riscy00

Hi Has anyone has thermal capacitance model for QFN (9x9) package with exposed pad 7 x 7 (or 6 x 6). Ideally between junction and case, junction case and board (JESD51-7 or similar). I wish to do transient with spice, to established how long it tak

Chip Components with big ground pads - Unsolder

Electronics Forum | Mon Jan 26 03:45:37 EST 2004 | Vinny

Hi All, We are producing a veriety of RF related PCBAs in which we see Unsolder/Mislaigned on a regular basis. In these baords usually one of the pad is connected to a signal trace and the other pad is connected to very huge ground plane. This gro

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