Electronics Forum: thermal pad (Page 21 of 51)

Criteria for thermocouple wire attachment

Electronics Forum | Thu Dec 21 21:37:19 EST 2006 | Jack

Hi Pavel, Real Chunks, Thanks for your valuable inputs..Selecting the correct location for board profiling is critical in determining the solder joint quality. Am I right to say TC wire attachment locations priority should be as below: (1) Thermal

Re: Off Pad Printing

Electronics Forum | Tue Jun 29 16:03:57 EDT 1999 | Dave F

snip | John and Dave, | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the past), to do things like placing 0603's on 0402 pad

PCB Pad become brownish after IR reflow

Electronics Forum | Fri Sep 18 07:32:53 EDT 2009 | karthikthebest

I agree with Graham cooper's input. Also note that the brownish color is incremental w.r.t to number of days you hold after the thermal cycle(example: after the reflow)so try to complete all thermal cycles ASAP to lessen the discoloring.

QFN Packages

Electronics Forum | Mon Feb 28 12:01:30 EST 2005 | Bob R.

We use QFNs in automotive products and have done a good bit of experimenting with pad designs, paste patterns, stencil thickness, and thermal via patterns. All of them have an effect on assembly and thermal cycle reliability. There is not a yes or

Solder cover

Electronics Forum | Wed Mar 03 23:07:59 EST 2010 | davef

If your "engineer reviewed the reflow profile and said this was not related to reflow conditions," then what does he think it's related to? We think that a increased effort to improve the thermal recipe to solder this part is required, because: * S

Re: Cracking Capacitors

Electronics Forum | Thu Sep 03 13:49:30 EDT 1998 | Earl Moon

| I am in need of possible causes and solutions to capacitors that are failing in the field. | Are there issues in our process that need to be | checked? | Some people said the problems are due to improper | storage. Others say it is thermal stre

Touch or no touch-up

Electronics Forum | Fri Feb 11 08:15:35 EST 2005 | davef

It sounds like you already know the answer. Hand soldering is much more stressful to a board than mass soldering, because: * It is more localized and there is no preheat. * It is more difficult to control. [Different connections require different h

28 pin QFN Pads.

Electronics Forum | Thu Sep 16 08:47:39 EDT 2010 | headlad

I extended the pads to help ensure the component locates correctly and to allow for easier re-work should problems occur. I reduced the thermal by 5% but you may want to speak to your fabricator and ask what they require to ensure that the resist is

Re: HASL vs. ENIG

Electronics Forum | Thu Dec 14 19:32:05 EST 2000 | Dave F

Wow, someone read the fine SMTnet Archives!!!! Scary, get their name!!! [OK, I�ll stop ... Several points are: * Most of the stuff in the fine SMTnet Archives is all the bad things that we can make-up to respond to the questions people ask. Ther

Re: Skewing chip components

Electronics Forum | Thu Jun 22 11:42:29 EDT 2000 | Chrys Shea

Sal, Silly question: Were the parts skewed before they went into the oven? I've chased down a few similar reflow problems in my lifetime, only to find out it was a pick and place problem. Wrong nozzle size, bad nozzle, feeder not advancing all


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