thermal pad

"thermal pad" search results in the Electronics Forums

484 results found for "thermal pad" in the Electronics Forums

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What is the QFN or Device Voiding Levels Needed for Automotive Industry for Power Devices for Electric Vehicles?

Mar 16, 2017 | It's the same thermal issue whether it's a die or package. It's different if it is just a signal tr

Interpretation for IPC 600H for Clause 3.3.2 (Lifted Land - Cross Sectioned)

Apr 28, 2014 | We found repeated pad lifted after different SMT Reflow temperature (eg: 243 deg C and 233 deg C) at

SMT voiding

Sep 25, 2012 | The more that I chew the idea of outgassing through the pad theory, the less I like it. Why would so

Reflow oven reliability?

Sep 10, 2012 | After selecting a few ovens based on the mfr's specifications, I plan to send them a thermal "slug"

63/37 Solder Paste mix

May 11, 2012 |

2512 Solder Crack

Aug 24, 2011 | Hello all, We just got some board back from thermal shock and we found that several of the 2512 r

Multiple Resistor Rework

Aug 30, 2010 |

I need an Oven

Apr 26, 2010 | I always fix thermocouples to pcb pads across its width. Then rotate it 180 degrees to check reading


Sep 9, 2008 | We consider "IR-reflow soldering profile" to be the supplier's recommended reflow thermal profile th

Solder Cracking

Aug 11, 2008 |

BGA Voids

Feb 12, 2008 |

Anyone facing QFN package crack problem ?

Dec 2, 2007 | Hi, There are QFN 32,40,48 pins with middle pad. Body size are 7x7 and pitch 0.5mm. I means as com

Epoxy on bottom of SMT component

Nov 27, 2007 | Q1: How many mils the gap between the terminal and pad? A1: It depends on properties of the glue an

Solder wick on Ag/Pd termination

Oct 23, 2007 | We're not really sure. Usually when solder leaves the pads and wicks-up a component lead, it means t

lead free pcb plating?

Jul 28, 2007 |

Thermocouple Design

Apr 5, 2007 |


Feb 12, 2007 |

BGA opens

Jan 28, 2007 |

BGA opens / cracks

Jan 24, 2007 |

Solderbridges wave soldering

Dec 4, 2006 | Keep in mind that device pitch, pad geometry, lead length and even alloy type will play a roll in yo

Dewetting on Second side reflow?????

Nov 1, 2006 | See if the solder is leaving the pad(s) and is wicking up the component. This is long shot but I

Reflow Oven Profiling

Apr 25, 2006 |

Fighting solder beads

Mar 20, 2006 |

Tombstoning 0306's

Sep 9, 2005 | If the tombstoning is thermal (occuring during reflow) then try slightly reducing the stencil apertu


Aug 24, 2005 |

BGA SEM test

Jul 27, 2005 |

How to avoid tombstoning in 0201 components

Jul 5, 2005 | So your thermal cycling test is putting these solder joints into reflow (183C + if they are lead joi


Dec 3, 2004 | The voids are between the interface of the pad and the solder joint of component chips. I have a goo

solder balls

May 12, 2004 |

Tombstone defect

May 21, 2003 |

BGA Picture Evaluation

Apr 9, 2003 |

Bare PCB baking

Nov 20, 2002 |

Immersion Silver

Nov 6, 2002 | cvrgrrrl Your first thermal cycle with imm silver should be the easiest to solder. That you see

Connector solderability

Nov 6, 2002 |

Wave soldering STSOP32

Oct 23, 2002 |

Dual Lane Reflow Oven

pcb components vacuum pick up