thermal pad

"thermal pad" search results in the Electronics Forums



484 results found for "thermal pad" in the Electronics Forums

Order by: Relevancy |   Date

What is the QFN or Device Voiding Levels Needed for Automotive Industry for Power Devices for Electric Vehicles?

Mar 16, 2017 | It's the same thermal issue whether it's a die or package. It's different if it is just a signal tr

PCB profiling

Feb 16, 2015 |

Reflow oven reliability?

Sep 10, 2012 | After selecting a few ovens based on the mfr's specifications, I plan to send them a thermal "slug"

I need an Oven

Apr 26, 2010 | I always fix thermocouples to pcb pads across its width. Then rotate it 180 degrees to check reading

Solder Cracking

Aug 11, 2008 |

BGA Voids

Feb 12, 2008 |

Epoxy on bottom of SMT component

Nov 27, 2007 | Q1: How many mils the gap between the terminal and pad? A1: It depends on properties of the glue an

SMT

Feb 12, 2007 |

BGA opens

Jan 28, 2007 |

Glass Wicking

Nov 7, 2006 |

Fighting solder beads

Mar 20, 2006 |

REFLOW PROFILE NEED HELP

Aug 24, 2005 |

Unknown

Jan 20, 2005 |

Voids

Dec 3, 2004 | The voids are between the interface of the pad and the solder joint of component chips. I have a goo

Lead Free ...

Sep 2, 2004 |

solder balls

May 12, 2004 |

Soldermask thickness

Oct 6, 2003 | It was a nice discussion. What I did here was a thermal shock test 1 hour@ +90 deg.c and immediatel

BGA Picture Evaluation

Apr 9, 2003 |

Immersion Silver

Nov 6, 2002 | cvrgrrrl Your first thermal cycle with imm silver should be the easiest to solder. That you see

Connector solderability

Nov 6, 2002 |

Wave soldering STSOP32

Oct 23, 2002 |

imm. silver

Aug 30, 2002 | Imm silver holds-up to multiple thermal cycles very well. The things, we guess, are happening to ma

OSP / Paste Printing Problems

Aug 29, 2002 | That you are getting BIG gobs of solder on the pads indicates that your print / paste process is pro

lead coalescence in solder joint

Jan 30, 2002 | Hello Dave, Mechanically the conection between the component pad and PCB pad is good (the solder

Profile

Jan 8, 2002 |

Soldering

Dec 5, 2001 |

QFP Defect

Jun 25, 2001 |

via as test point

Feb 26, 2001 |

BGA shorts

Feb 14, 2001 | BGA Shorting 1 Damaged mask in between the BGA pad and via on the substrate. 2 Poor print reg

Chromatography

pcb assembly equipment auction