Electronics Forum | Mon May 14 17:12:20 EDT 2001 | davef
Continuing along the path that Brian took ... IPC-7525 gives design guideline for stepped stencils. It goes something like: * Stepped area SB GT 25 thou from pads located on the greatest thickness of the stencil * Pads in stepped area SB GT 35 tho
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
Electronics Forum | Tue Aug 10 09:09:39 EDT 2004 | mattkehoe
wash->ssd top->wash->sticky flux bottom side->place smt components->reflow->wash->sticky flux top side->place topside smt components->reflow->wash) ssd is basically the process of applying solder paste to the pcb with a stencil and the solder reflowe
Electronics Forum | Sat Oct 09 10:30:24 EDT 1999 | bix
| | | | | Can anyone tell me the formula/method to determine | | | | | the amount of weight that solder's surface tension can support. | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | of a board during a top side refl
Electronics Forum | Fri Sep 10 11:45:09 EDT 1999 | Scott S. Snider
| scott. | I appreciate your sincere answer. | would tell me the hint about printer if i's possible | To tune our smt process we have to know what is the major X's | for defect. To know major X's with DOE we need a good measurement equipment.
Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F
=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so
Electronics Forum | Fri Aug 13 08:14:38 EDT 1999 | Peter Barton
| Ladies and Gentlemen, | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav tremendous
Electronics Forum | Fri Aug 13 10:00:45 EDT 1999 | Boca
| | Ladies and Gentlemen, | | | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav treme
Electronics Forum | Fri Aug 13 13:00:08 EDT 1999 | Earl Moon
| | | Ladies and Gentlemen, | | | | | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I would hav
Electronics Forum | Fri Aug 13 13:25:09 EDT 1999 | ScottM
| | | | Ladies and Gentlemen, | | | | | | | | As a newly appointed DFM/CE "guru" here, one of my responsibilities has become repair (of course). As I have some knowledge of BGA repair/rework using semi-automated equipment, it naturally follows I wou
