Electronics Forum | Wed Nov 13 16:48:19 EST 2013 | spoiltforchoice
I would expect any half decent machine to place 0603 parts slap bang on target to the typical defined accuracy for such parts on most machines of perhaps ~60 microns or better. Self correction during reflow is IMHO much less pronounced with lead-free
Electronics Forum | Wed Feb 19 19:20:41 EST 2014 | comatose
That's a pretty vague question, especially if you count "ID" in the time. In a world where you have AOI or in circuit testing telling you which part has to go, limited thermal mass to contend with and decent equipment, I'd say thirty seconds. On my
Electronics Forum | Mon Apr 28 02:22:52 EDT 2014 | jkhiew
We found repeated pad lifted after different SMT Reflow temperature (eg: 243 deg C and 233 deg C) at an isolated slot. The PCB Supplier had claimed that such condition is acceptable as per IPC 600H Clause 3.3.2 (Cross Sections) - eg: Acceptable - C
Electronics Forum | Mon Apr 28 15:20:50 EDT 2014 | davef
Your customer is correct. Your supplier has clamped some sort of machine to your butt and has plugged it in the wall outlet. Honest mistake: * IPC-A-600H, 3.3.2 Lifted Lands - (Cross Sections) ... pertains to boards that were cross sectioned after t
Electronics Forum | Fri Jun 06 16:25:03 EDT 2014 | spitkis2
Component manufacturers subject their lots to thermal / reflow testing per IPC /JEDEC STD-020. This involves running the parts through an oven 3X with a peak above 260C. I am not certain if passives go through the same test (theoretically they shou
Electronics Forum | Fri Oct 10 20:56:50 EDT 2014 | jlawson
Main issues... Pad Design Thermal Mismatch Design related to pads effected Moisture and out gassing in substrate / part terminations can move parts slightly during preheat prior to liquidous this get position shift ( smaller the parts more an issue)
Electronics Forum | Fri Jan 30 00:41:04 EST 2015 | neeraj_iiser
Thanks a lot , my application is cryogenic in nature. I am trying to make a Sub-Angstrom resolution Thermal expansion sensor, whose components have been machined out of OHFC copper, and i needed to solder a manganin wire to one of the capcitor plates
Electronics Forum | Fri Mar 06 12:02:36 EST 2015 | saoasasd
So far we have tried diferent date codes, solder pastes and PCBA models (same component used in different projects). We have also sent some components for plating analysis and we are waiting the LAB feedback. Additionally, we have tried components wi
Electronics Forum | Wed Apr 22 21:21:06 EDT 2015 | comatose
We see this from time to time. Usually, one of the leads of an electrolytic is attached to a ground plane, and the other to a trace. The ground plane acts as a big heat sink and reflows significantly later than the trace. If you have glue in your li
Electronics Forum | Fri May 15 21:39:48 EDT 2015 | jlawson
Reflow.. 1.Rehm (Germany) - Best in Class Best overall process stability heating system ( Alot of makers have started to copy there VX heating arrangement ). COnveyor chains can be a bit more attention in terms of maintenance on rehm , but if foll
