Electronics Forum | Wed Sep 29 04:33:35 EDT 1999 | Earl Moon
| | Hi All, | | Any one experince BGA-chipset warp about 10-15mil after removing | | from PCB? | | FYI, the rework temperature for preheat was 170C from room | | temperature about 30 seconds, & BGA was removed at temperature | | between 190-200C.
Electronics Forum | Wed Sep 08 17:31:58 EDT 1999 | Earl Moon
| I am wave soldering a single sided through hole PCB array with (6) .040" round diameter pins that sit .5" off the PCB, and .080" apart. The problem being experienced is that solderballs are appearing on the end of the pins. I have tried decreasin
Electronics Forum | Tue Sep 07 06:17:31 EDT 1999 | Earl Moon
| | My company is starting a prototype. The chips that will be used appear to be very sensitive. The vendor part number is Neta-40-2. | | My question is what solder temp should be used for this part? | | Any advice is appreciated. | | THX. | | | |
Electronics Forum | Thu Sep 02 04:26:02 EDT 1999 | Wolfgang Busko
| | To aid in heat dissipation of our PCB, we would like to try having copper fill areas on the board that are hot air levelled and not covered with solder resist. Then, when the board is reflowed, solder paste would be applied and then solder. Has a
Electronics Forum | Thu Aug 26 08:54:17 EDT 1999 | Dave F
| Having implemented the process of handling moisture sensitive devices our logistics department tries to classify all parts according to their moisture level. | Going through datasheets wasn�t that helpfull, so does anyone know of a source for that
Electronics Forum | Tue Aug 24 09:13:17 EDT 1999 | Earl Moon
Again, I really appreciate the valuable input you all provided. Got my Air-Vac SRM4 machine Friday afternoon. Stored it safely in my cube over the week-end for safe keeping. Tried to find 220V single phase next to air with no luck yesterday. Electric
Electronics Forum | Mon Aug 23 10:34:09 EDT 1999 | Greg Jones
I am looking for a rule of thumb regarding the maximum ramp standard components (chip capacitors) can tolerate without failure during the reflow process. The standard seems to be 3C\second, but this figure is generally derived from the average ramp
Electronics Forum | Wed Aug 18 21:25:37 EDT 1999 | Tony Yang
| WE ARE CURRENTLY HAVING PROBLEMS REFLOWING BOARDS WITH WHITE TIN PLATING. WE ARE NOT GETTING GOOD WETTING ON THE PADS. | WE HAVE CHECKED THE REFLOW PROFILE AND TRIED DIFFERENT PASTE'S. | WE THINK THERE MAY BE CONTAMINATION OR OXIDATION ON THE PADS.
Electronics Forum | Thu Jul 22 04:34:54 EDT 1999 | George Verboven
| Which among the two profiling method is more reliable/accurate in getting the oven thermal profile? | | a) using a HIGH-TEMP solder wire then soldering the thermocouples onto the profile points of the board (e.g. component lead etc.) | | b) not s
Electronics Forum | Mon May 24 10:17:54 EDT 1999 | john thorup
| Can anyone steer me towards a supplier of heatsinks suitable for use on a PQFP 160. Before you shoot me down in flames, I know that I am not going to get much heat away from the die because of the plastic but the application is such that the board
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