Electronics Forum | Wed Jan 21 10:13:14 EST 2004 | ADAM
What is the most effecient form of heating ,ie calrod, IR, convection , or a mixture ? to produce a good thermal profile on a wavesoldering system on thermally challenging multi-layered boards? Thanks Adam
Electronics Forum | Wed Mar 03 05:07:06 EST 2004 | Javi
Hello, I would like to design the thermal reliefs/pads of my through-hole components. I would appreciate any info, doc or link about how design them (dimensions, slit width, circular or square, etc). Thanks a lot and best regards, Javi
Electronics Forum | Mon Apr 04 08:01:49 EDT 2005 | davef
Can you run one thermal cycle to attach the BGA and then a different thermal cycle to attach the connector?
Electronics Forum | Tue Oct 11 14:10:51 EDT 2005 | Amol
Hi, I have a very basic question for tin whisker testing. Do I thermal cycle/age the Components only or solder them to a ckt board and then thermal cycle/age the PCB assembly??
Electronics Forum | Thu Mar 09 04:04:48 EST 2006 | dougs
one point to remember is to have a large stencil reduction on the thermal pad, you need to reduce the solder volume by about 35%, if you don't you risk the solder from the thermal pad shorting out the other leads or the solder volume causing the comp
Electronics Forum | Wed Apr 18 21:35:26 EDT 2007 | davef
Thermal conductivity [W/m-*C] * Conformal coating [AR, ER, UR]: 17-21 * Epoxy molding compound: 0.6
Electronics Forum | Thu Apr 19 14:00:28 EDT 2007 | cecil
Dave, When we converted the Humiseal thermal conductivity info into W/m-*C we came up with .167 - .209. Did we do somthing wrong with our conversion?
Electronics Forum | Mon Jul 07 09:21:46 EDT 2008 | mbnetto
Hello, I have some troubles to find datasheets for BGA VIA Tech. I found some datasheets, but the thermal information I can not find this information. Can anybody help me how can I find the thermal information? Thanks...
Electronics Forum | Mon Oct 27 23:25:56 EDT 2008 | davef
Each thermal cycle decreases the thickness of the OSP. So depending on the material, fabrication method, and blablabla; after one thermal cycle we'd expect the OSP to provide adequate protection for a couple of days. After that, you may need a more a
Electronics Forum | Wed Jan 28 08:56:40 EST 2009 | blnorman
Don't know the specifics from the IPC spec. However our standard internal spec dictates - highest thermal mass, lowest thermal, most critical component, and center of PCB on the laminate surface. Our profilers have 6 inputs, so the other 2 are dete
