Electronics Forum | Tue May 21 17:16:51 EDT 2002 | davef
Larry, Yes, no matter how much you�d like to avoid using NC, you probably will have to start using the stuff, if the design [sales, in your case] types have their way. We can clean WS under 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use NC.
Electronics Forum | Fri Jun 14 09:15:02 EDT 2002 | edahi
DaveF, Yeah you got that right...because the initial stages of the project, the products would only attach 1 passive (capacitor) hell when things got too cheesy they wanted to attach 20 caps or so....this is not like board assembly, this only 1 Flip
Electronics Forum | Thu Jun 20 18:56:31 EDT 2002 | stepheno
If you don't already have one, the best investment you can make in your case is a good thermometer/humidity meter. They are not at all expensive. Then record the temperature and RH about 4 times a shift. After a few weeks (maybe sooner) you can se
Electronics Forum | Thu Jun 13 20:55:46 EDT 2002 | russ
Having just gine through a similar problem myself (with much less equip.) Here are a few things to consider and/or look at Do you have the proper pad size? It should be the same size as the pad on the BGA. Is the board warping during your operati
Electronics Forum | Fri Jun 28 01:06:49 EDT 2002 | Dreamsniper
Hi Steve, We have a Heller 1088 (4 Zone Oven) and we are using Indium NC92 with 2% silver. My Oven setting is: Zone 1 Top & Btm 125 Zone 2 Top & Btm 145 Zone 3 Top & Btm 188 Zone 4 Top & Btm 265 Belt Speed 34 cm/min I have run a profile
Electronics Forum | Tue Jul 30 11:30:23 EDT 2002 | slthomas
We currently use the SuperMole and generally speaking it's a nice tool and gives us the information we need. The software could use some work, though. When you create a file for a new profile, you have to input a "time above" temperature for your
Electronics Forum | Fri Aug 02 12:07:50 EDT 2002 | johnw
Richard, your asking a multi million dollar question that in my own opinion no one can give you the right answer since no one really knows. hence I think the lack of answers to your question....thought there would be more people willing to propose a
Electronics Forum | Fri Aug 02 12:01:40 EDT 2002 | johnw
interesting, not at all what we were told so yes lot's of contradictions comming from them, I have to say personally I've not beein impressed with there technical service of late, are they getting complacent I ask? it's strange they say it'll cause
Electronics Forum | Thu Sep 26 11:44:23 EDT 2002 | abelardo
Hello everyone out there in the SMT world. I have a dilema I'm currently running a board that has 3 csp's with a .75 mm. ball pitch and .3mm ball size. And 2 qfp's-160. The stencil is 4 mils thick and I'm using a 63/37 solder paste. My reflow prof
Electronics Forum | Wed Oct 30 02:37:58 EST 2002 | Dreamsniper
Hi Guys, I have a fine pitch QFP that I suspect of having a solderability (wetability) problem. The heel joint is 50%-75% of the lead thickness so it means that I passed the IPC Class 2 recommended criteria on the Heel. The toe has at least 25%-50% s
