Electronics Forum | Fri Mar 21 14:44:02 EST 2003 | Stephen
I once worked for a new branch of a company. We had a board where one of two tants would shift in the oven. When I phoned up HQ because they had ran the board before as soon as I said the product name their guy said "C148 shifts in the oven" He knew
Electronics Forum | Wed May 21 12:55:35 EDT 2003 | Zhenya
Several things for your reference: 1. Starting with data collection: - Have you done a measle chart to illustrate the pattern of the defect? - Have you checked the corelation between shift/time and defects rate? - How about a pareto chart? - Do
Electronics Forum | Wed Oct 15 09:53:01 EDT 2003 | markhoch
These boards also were above liquidus for 75 seconds, and the customer puts the boards thru extensive thermal shock and stress testing. An Alpha Applications engineer told me that because the boards were above 183 degrees for 65-75 seconds that the i
Electronics Forum | Mon Jul 19 21:25:28 EDT 2004 | davef
It seems like the flux is burning-up before the metal begins to flow on this slightly odd component. Alpha talks about alternate reflow recipes for WS609, as follows: * A straight ramp up profile is preferred for reflowing low to medium thermal mass
Electronics Forum | Fri Oct 08 09:43:27 EDT 2004 | davef
First, don't get too excited about the thermal capabilities of conductive epoxy. An epoxy like DuPont CB-100 increases the amount of heat conducted through the barrel, but many over estimate what it can do. Calculations show for a 0.020" drilled
Electronics Forum | Thu Feb 10 16:45:36 EST 2005 | pjc
It all depends on what type of board you need to solder. If your boards are small in size and low thermal mass and your conveyor speed requirments are normal, then I'd say the OmniFlo 7 will do the job. It has a max zone temp setting of 280C. The cur
Electronics Forum | Thu Dec 21 02:27:57 EST 2006 | pavel_murtishev
Good morning, (1) This depends on component type. In general it would be better to have fully populated board. Or at least you should mount components with different thermal mass. You should place TC�s at three points at least: component with high t
Electronics Forum | Thu Mar 29 08:46:23 EDT 2007 | realchunks
Well I DO KNOW! Hi aj, 100% on the lead pads and 50% reduction on the center pad if you do not use thermal vias. If you do use thermal vias, you may need to increase the amount of paste needed, but not by much. 50% will be a good start. After re
Electronics Forum | Thu Apr 26 08:27:30 EDT 2007 | ck_the_flip
If your product mix is similar in terms of thermal mass and componentry, find some standard setpoints (by doing a baseline profile) which will produce a thermal profile that's within the specs. of your solder paste and product. This approach usually
Electronics Forum | Fri Jun 15 12:12:34 EDT 2007 | realchunks
Hi Ed, It all depends on more info needed. How many preheaers do you have in your wave? One, two, three? Are you talking bottom side preheat? What size boards do you run and what type of parts are on it. Typically, preheat does several things; w
