Electronics Forum | Wed Jul 10 10:14:17 EDT 2019 | solderingpro
Check these out: https://www.promationusa.com/quick-usa-ts1200 Great technology and thermal feedback loop without breaking the bank.
Electronics Forum | Thu Aug 08 10:32:30 EDT 2019 | SMTA-Joe
Ok, interesting. Unfortunately I can't speak on that. We always treat these as a 2nd ops and have never had a problem. We determined it was something that could add to thermal trouble. Also, the amount of solder added during paste deposition may not
Electronics Forum | Thu Aug 15 09:36:48 EDT 2019 | davef
It could be delamination of the layered material of the MLCC caused by thermal shock or a component fabrication defect. For more on MLCC cracks: https://www.avx.com/docs/techinfo/CeramicCapacitors/cracks.pdf
Electronics Forum | Wed Oct 09 13:02:34 EDT 2019 | slthomas
Hi Joe, Could you provide images of the part and the install location? I'm having a hard time picturing what it is that is required.
Electronics Forum | Wed Oct 09 17:57:23 EDT 2019 | SMTA-Joe
Unfortunately I don't have the product in hand at the moment. I'm trying to pre-empt the next run. I will see if I can get an image!
Electronics Forum | Wed Oct 09 17:58:56 EDT 2019 | SMTA-Joe
I'm not sure there is so much of an advantage as much as it may be just easier to apply? New to dispensing, especially in this application, so I'm mainly brainstorming at this point. I will look into the manufacturers you listed though. Thanks for
Electronics Forum | Tue Nov 26 09:07:16 EST 2019 | scotceltic
I am more worried about those voids also instead of the voids in the thermal pads. I still can't find any IPC spec that calls out a min. void percentage other than on BGA packages.
Electronics Forum | Mon Feb 10 12:35:11 EST 2020 | emeto
on 10 zone ovens with 3 cooling zones, my negative slope is between 2.5 to 4 deg C/second based on board size and thermal mass.
Electronics Forum | Sun Apr 19 11:19:52 EDT 2020 | davef
A-610G 7.5.16 Components with Bottom Thermal Plane Terminations (D-Pak) says: 100% wetting to land in the end-joint contact area. Is that what you're asking about? Regards, David Fish [davef] Technical Editor & Customer Advocate
Electronics Forum | Mon Aug 03 17:15:56 EDT 2020 | rgduval
In general, no. If you've got the right BGA rework equipment, you should be able to locally heat the part area that you're reworking. Though, if you're finding defects related to thermal stress, it might not be a bad idea to pre-heat the rest of th
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