Electronics Forum | Mon Nov 05 20:31:09 EST 2001 | davef
Most people do not intend to �solder� Type K thermocouples. They use solder to �attach� the thermocouple. Search the fine SMTnet Archives for a posting by Chrys Shea. 1 Common thermocouple types commonly used for thermal profiling are: * Type K �
Electronics Forum | Wed Nov 21 04:46:27 EST 2001 | emmanuel
Yes, i confirm you that the BGA i'm refering to are Motorola BGA. The fractures that appear after 500 thermal cycles (-45�C/+125�C) are located in the solder joint/pad connection. We have been asked if this fractures are due to BGA & PCB design or to
Electronics Forum | Tue Dec 18 15:05:58 EST 2001 | blnorman
What is the maximum allowable thermal ramp rate for wave solder. We have a "short" machine used for selective soldering. To get the boards up to temp, we need to exceed our normal 2�C/sec. Are there any IPC documents governing this process? Anyon
Electronics Forum | Tue Dec 18 23:43:38 EST 2001 | Dreamsniper
Hi Dave F, Tried to use Contaval Pallets but it only worsens the situation. Prior to the retrofit of the Edge Hold Conveyor, our oven profiles were running well. It is probably due to the retrofit as it made the pcb 30mm farther from the bottom heat
Electronics Forum | Thu Dec 20 14:14:16 EST 2001 | Dreamsniper
Hi Dafe F, The edge hold conveyor was installed due to the double sided process on our new products. Remember the Stencil Printing Adhesives versus Dispensing in the forum a year ago? Well that led us to acquiring a Camalot 3800...This time it's the
Electronics Forum | Mon Dec 31 08:11:23 EST 2001 | hany_khoga
Dear all : We are suffering a severe curvature in our boards when coming out of the wave solder m/c. An Engineer suggested to enter them again for a second pass in the m/c expecting board were thermally mistreated just after the W.S. Can this real
Electronics Forum | Tue Jan 22 20:26:18 EST 2002 | davef
Help us visualize this better. * What color white [ie, yellow/white, green/white, a haze, etc.] are we talking about? * What size and shape are the spots? * Where are the spots located? * Etc Help us understand what�s going on by describing the sp
Electronics Forum | Thu May 23 14:35:40 EDT 2002 | pjc
There are instruments from ECD, KIC and Datapaq that are used in addition to classic profiling for oven thermal management and they also have some very efficient prediction software for profiling. I am not an advocate of common profiles. Most boards
Electronics Forum | Wed Jun 12 03:26:03 EDT 2002 | edahi
We are currently having gross tombstoning with 0402 capacitors. We are using HiPb Solder Paste mounted on Laminate substrates. We are assembling Flip Chip BGA's. Temp @ Reflow is around 230-240 C to meet the thermal requirements for both die bump
Electronics Forum | Sun Jun 30 20:00:56 EDT 2002 | redmary
the SOIC encounter solder crack after reliability test, the common process is: SMT---manual soldering---IPT(in process test)---potting---T/C(thermal cycling,only add current and voltage)---B/T and F/T (burn in and functional test). the condition is 2
.gif)
