Electronics Forum | Sun Apr 07 18:21:08 EDT 2002 | murt
Hi I am a collage student and I was wondering if anyone could explain to me how you would estimate the trough-put, product and cycle time for a double-sided mixed technology pcb assembly. I would be grateful for any information Thanks Martin.
Electronics Forum | Mon Jun 03 13:26:32 EDT 2019 | az2019
Hi, I have a general question about the relationship of PCB thickness and BLR testing result. For example, I have QFN6x6 parts mounted on board in 1.2mm, 1.6mm, and 2.4mm thickness. All boards have 6 layers of Cu. Studies show thicker board gives les
Electronics Forum | Fri Jan 30 14:20:55 EST 2009 | scottp
I do a lot of thermal cycle testing of new components for my company and often when I lay out a test board I'm trying to simulate 4 or 6 layer boards but I don't need them for routing so I just use a solid fill of a cross-hatch pattern. I've done it
Electronics Forum | Tue Aug 31 17:36:36 EDT 2004 | davef
NO-LEAD COMPONENTS WITH LEAD SOLDER ISSUE: We agree with Russ. We've dicussed this several times on SMTnet. For instance, look here http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=25394 LEAD COMPONENTS WITH NO-LEAD SOLDER ISSUE: We disa
Electronics Forum | Sat Nov 03 11:08:24 EDT 2012 | anvil1021
We have experience with this alloy, but with enig and we did start with PB HASL, none of our PCBs would of course pass thermal cycling at normal temperatures with the HASL so we went to ENIG. we could thermal cycle at 100-115C with no issues. We foun
Electronics Forum | Wed Nov 07 21:36:17 EST 2012 | davef
Multiple process and rework thermal cycles are brutal on boards and components. Improving reliability of products through reducing thermal stress ends-up being a major driver to the interest in lower MP LF solders. Binary LF solders require the addit
Electronics Forum | Fri Oct 18 12:40:35 EDT 2013 | robertwillis
Back in the mists of time there were two papers on the use of Parylene Coating and the improved thermal cycling results in 1990. It was on LCCC then shortly after on BGA. Does anyone know of results of recent trials or have a copy of the BGA papers.
Electronics Forum | Wed Jun 24 16:23:29 EDT 1998 | Justin Medernach
| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, Your concer
Electronics Forum | Mon Apr 12 19:28:26 EDT 1999 | Tom B
Netters, When I reflow a PCB there is a discoloration of silkscreen and mask. It appears if Profile is too hot! But I dont think so, maybe I'm wrong? 1. Kester 293 no clean 2. 2.1 C/s for 30s to 150 C 3. .5 - .7 C/s for 60s to 185 C 4. 1.5 C/s u
Electronics Forum | Fri May 15 21:39:48 EDT 2015 | jlawson
Reflow.. 1.Rehm (Germany) - Best in Class Best overall process stability heating system ( Alot of makers have started to copy there VX heating arrangement ). COnveyor chains can be a bit more attention in terms of maintenance on rehm , but if foll
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