Electronics Forum: thermal fatigue (Page 1 of 4)

Thermal fatigue of solder joints

Electronics Forum | Thu Oct 26 03:20:13 EDT 2000 | heccles

What would be a typical thermal test regime to verify the quality of solder joints for high specification applications - what would be the specific benefits of utilizing a "HALT" process over other traditional test techniques ?

Re: Thermal fatigue of solder joints

Electronics Forum | Thu Oct 26 09:10:30 EDT 2000 | ptvianc

I am not familiar with the "HALT" terminology. Do you mean HAST testing? As for thermal fatigue, the most severe conditions are typically those cited for military and/or satellite applications. There are several temperature ranges that are used to

Re: Thermal fatigue of solder joints

Electronics Forum | Sat Nov 25 03:51:04 EST 2000 | carsonho

HALT is an approach to stimulate a failure till its existence. It is mainly used during product design and development phase. Traditional tests are mainly used to prove "no" failure but HALT is to make failure for information to improve in design of

low thermal emf solder & paste - SAC 405

Electronics Forum | Mon May 12 15:08:53 EDT 2014 | davef

I've never used SAC405. Not for nothing ... Other low temperature solder alloys that you should consider are: * Sn42/Bi58 [138*C]: Alloy for low temperature applications. Attention should be paid to potential embrittlement issues and poor thermal fa

solder joint crack in post thermal cycling test at Dye & Pry

Electronics Forum | Tue Apr 13 08:21:05 EDT 2010 | esca

Hi manchella, After ATC test, two different failure modes can be present: solder FATIGUE (into bulk) or BRITTLE INTERMETALLIC fracture. So, first you have to verify this. Moreover, which brand of SMT paste have you used ? The crack into solder joint

High Power Reliability

Electronics Forum | Wed Aug 15 01:30:56 EDT 2007 | wayne_

To be more specific. I am actually talking about the electrical fatigue whereby a unit is undergo a cyclic electric test. Unlike thermal fatigue, it is all talking about temperature related testing, eg, ageing test, thermal cycle test, etc. Anyone of

TCE mismatch

Electronics Forum | Wed Feb 07 18:40:39 EST 2007 | bill

What is an acceptable mismatch for smt components and pcb. We are having cracked solder joints from fatigue after repeated thermal cycling 25 deg. c to 125 deg.c.

Re: Intermetallics and reflow profile

Electronics Forum | Wed May 03 20:24:22 EDT 2000 | Dave F

MF: I know of nothing that addresses your question directly. Let me suggest: * Technical types at your solder supplier should be able to help. * "Effect Of Intermetallic Compounds On The Thermal Fatigue Of Surface Mount Solder Joints" PL Tu, et a

Component Lead Finish - Article in Japanese Can some body help ?

Electronics Forum | Wed Nov 20 18:41:57 EST 2002 | slthomas

Here's part of what I could read: "We evaluated the influence of Lift-off (Fillet-lifting) and the influence of thermal fatigue, in this case on combination between various terminal platings of electronic components and Pb-free solder, Sn-37Pb solde

detecting BGA micro cracks

Electronics Forum | Thu Feb 11 08:14:41 EST 2010 | scottp

It's OK to have the daisychain done in the interposer rather than the die (and a lot cheaper) but in thermal cycling the parts MUST have representative die. That's where a large part of the CTE mismatch comes from to cause fatigue damage. Thermal c

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