Electronics Forum: thermal solutions (Page 1 of 12)

Power component thermal via

Electronics Forum | Tue Feb 01 04:11:58 EST 2000 | emmanuel

I am to assembly a power SO on the top side of a double side board. My designer has implemented a lot of thermal vias in the heat sink pad of this component. The problem is that i need to prevent the solder cream from polluting the bottom side of the

Re: Power component thermal via

Electronics Forum | Wed Feb 02 03:32:08 EST 2000 | pascal MATHIEU

emmanuel : i agree with Dave , it's easy to have blind hole on the bottom side , of course in this case you'll lose some thermal efficiency ;the second solution is to put on the bottom side between the board and your heatsink a soft thermal interfac

Pallet absorb thermal heat : compensate by higher deg-C?

Electronics Forum | Thu Jun 14 01:04:57 EDT 2001 | procon

Ian, It appears to me you are trying to reflow the star wars project. All this talk about thermal absorbtion, heat differential, etc., it' only a reflow profile? If you read back over the suggestions of all other memos, you will find the solution.

Ceramic PCBs

Electronics Forum | Mon Jan 14 08:52:09 EST 2008 | geb

Have you considered metal Clad IMS PCBs rather than ceramic ones? "The circuits can be shaped drilled and formed, an advantage when compared to ceramic based product." Have a look at DK Thermal Solutions website http://www.dkthermal.co.uk

Materials Specifications for Thermal PCBs with LED Applications

Electronics Forum | Wed Aug 12 22:28:20 EDT 2009 | boardhouse

When choosing materials, do you specify your > thermal PCB needs? For instance, are you > specifying temperature or are you selecting > materials by brand name? With this type of product I would call out the material Manufacture and brand - Such

Frequency to verify the reflow profile

Electronics Forum | Fri Jun 03 04:16:27 EDT 2005 | Bryan She

Background: We use a thermal boards to setup/profiling the reflow oven for pilot run.and then daily verify the reflow profile with this thermal board.Now we phased into LF production,and the LF thermal board can only withstand 25~30 times reflow excu

how clean is clean?

Electronics Forum | Thu May 26 19:32:13 EDT 2005 | Mike Konrad

Three popular methods: Resistivity of Solvent Extract (ROSE) Test Method IPC-TM-650 2.3.25: The ROSE test method is used as a process control tool to detect the presence of bulk ionics. The IPC upper limit is set at 10.0 *g/NaCl/in2. This test is p

Automated or Semi-Automated Thermal Gel Application

Electronics Forum | Wed Oct 16 10:51:35 EDT 2019 | radialvalve

Hi Joe, sorry for the delay in responding to your request, hope it's not too late. There are several questions to be answered before we can guide you to the best solution to meet your Thermal Gel Dispensing Needs. I would like the opportunity to disc

BGA underfilling

Electronics Forum | Mon Nov 12 10:57:36 EST 2001 | emmanuel

We are to use a PBGA 272 and a PBGA 388. Between 500 and 750 thermal shocks (-45�C/+125�C), we have noticed that some cracks appear in the solder joints. According to our component specialists, these cracks are due to the whole design (pcb, component

driving triacs in power supply

Electronics Forum | Sat Jul 24 06:00:50 EDT 2004 | zlatkon

I need to build regulated power supply 0-30V 0-20 Amps. The only solution possible for minimizing the thermal loss is to use triacs on the secondary Trafo side in order to cut the sine for low voltage output and great current. (like 5V, 20A). Please

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