Electronics Forum: thermal stress testing (Page 1 of 58)

Re: temp stress reliability test for SMT solder bonds

Electronics Forum | Thu Apr 09 14:02:29 EDT 1998 | Earl Moon

I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whe

Thermal testing

Electronics Forum | Wed Jun 23 13:56:56 EDT 1999 | Stan Frul

Hi Could anyone tell me where i can find information, in the literature or on the Web, concerning measurements of temperature distribution, expansion, stresses in the substrate and heat sink and on the interface between them, that is all the range of

Re: temp stress reliability test for SMT solder bonds

Electronics Forum | Fri Apr 10 20:27:07 EDT 1998 | Jean-Paul Clech

I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to wheth

BGA, stress on the PCB

Electronics Forum | Fri Apr 16 08:20:58 EDT 2004 | Bob L.

We've seen problems with BGA balls breaking at in-circuit test. I did some bend testing and found that our large BGA's can handle amazing stresses at low strain rates but we get brittle fractures at high strain rates, especially with Ni/Au surface f

Re: Thermal testing

Electronics Forum | Thu Jun 24 11:29:50 EDT 1999 | Matt Stump

Hi Could anyone tell me where i can find information, in the literature or on the Web, concerning measurements of temperature distribution, expansion, stresses in the substrate and heat sink and on the interface between them, that is all the rang

Re: Vibration testing of BGA packages/assemblies

Electronics Forum | Tue Jan 05 10:17:25 EST 1999 | Earl Moon

Does anyone have any experience with vibration testing of BGA packages and assemblies? We are starting to design BGA's into some of our products and we have not found very much information on vibrational test results. Any information will be

Re: temp stress reliability test for SMT solder bonds

Electronics Forum | Thu Apr 09 13:57:33 EDT 1998 | Mike C

I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to wheth

temp stress reliability test for SMT solder bonds

Electronics Forum | Thu Apr 09 12:25:43 EDT 1998 | Dave Hammond

I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whether

Re: temp stress reliability test for SMT solder bonds

Electronics Forum | Thu Apr 09 12:33:43 EDT 1998 | Earl Moon

I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to wheth

Re: temp stress reliability test for SMT solder bonds

Electronics Forum | Thu Apr 09 14:05:54 EDT 1998 | Earl Moon

I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whe

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