Electronics Forum | Fri Apr 24 14:34:14 EDT 1998 | Ed Holton
Looking for anyone who has experience with high temperature soldering. Need to determine why solder joints are failing. Thermocycling of unit is -40C to +140C, 30 minute dwell time, 10 sec. transition time Your help is appreciated Ed Holton Hella E
Electronics Forum | Mon Apr 26 14:37:42 EDT 2004 | wgaffubar
We see this sometimes but I have found it to happen based on how fast the solder is cooled back into a solid. Pull strength test and thermocycling show no problem with solder joint integrity.
Electronics Forum | Fri Apr 24 15:21:08 EDT 1998 | Earl Moon
| Looking for anyone who has experience with high temperature soldering. Need to determine why solder joints are failing. Thermocycling of unit is -40C to +140C, 30 minute dwell time, 10 sec. transition time | Your help is appreciated | Ed Holton |
Electronics Forum | Sun Jul 12 21:07:07 EDT 2009 | padawanlinuxero
I have a problem we change a product from leaded to lead free, I was not involve in the selection of the new reed switch, but now we are having problems with the hermeticity in the switch,this occurs after is overmould and put to a 6 cycles in the th
Electronics Forum | Fri Apr 24 20:33:06 EDT 1998 | D.Lange
| Looking for anyone who has experience with high temperature soldering. Need to determine why solder joints are failing. Thermocycling of unit is -40C to +140C, 30 minute dwell time, 10 sec. transition time | Your help is appreciated | Ed Holton |
Electronics Forum | Wed Oct 23 16:17:17 EDT 2002 | nwyatt
CSP is similar to BGA process in that you need to undergo a reflow process to properly solder the chip. Also, a soak period is desirable to promote outgassing. You do not need nitrogen. We are building CSPs in a regular convection oven without n
Electronics Forum | Thu Feb 03 21:17:07 EST 2000 | Dave F
AF: Unfortunately, there is no "acceptable number of cycles" either in air-to-air and one liquid-liquid thermocycling, nor interconnect stress testing. There can be a "minimum threshold" that would assure no failures as the result of the assembly p
Electronics Forum | Fri Sep 10 11:45:09 EDT 1999 | Scott S. Snider
| scott. | I appreciate your sincere answer. | would tell me the hint about printer if i's possible | To tune our smt process we have to know what is the major X's | for defect. To know major X's with DOE we need a good measurement equipment.
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