Electronics Forum: thickness (Page 1 of 269)

ImSn thickness

Electronics Forum | Fri Feb 16 08:28:50 EST 2007 | pavel_murtishev

Good afternoon, Typical plating thickness for immersion tin is 0.6-1.0um. I do not know what the maximal thickness is. But plating is self-limiting process and I believe maximal thickness should be about 2-3um. BR, Pavel

Gold thickness

Electronics Forum | Thu Jul 10 09:16:41 EDT 2008 | aj

Hi all, What should the typical gold thickness be on ENIG boards ? aj...

Soldermask thickness

Electronics Forum | Wed Oct 01 21:22:37 EDT 2003 | ramanandkini

We have a 1.6 mm thick automotive PCB board of size 35x70mm. One of our vendor has given us a batch with lesser soldermask thickness 5~8 microns. Will this affect the circuit board on a long term. What should be standard for the soldermask thickness?

ImSn thickness

Electronics Forum | Fri Feb 16 08:04:05 EST 2007 | GS

Hi, questions about PCB ImSn finishing : a) how much is the standard thickness (most common)? b) how much is the maximum thickness obtainable by this finishing process? Thank you Regards....GS

Plating thickness

Electronics Forum | Tue Aug 17 13:24:47 EDT 2004 | blnorman

We have parts that have electroplated tin over nickel. The mfg. assures us the minimum thickness of the tin is 5 microns. Cross sections have shown many instances of 1 micron and pits that go down to the nickel barrier layer. A request for thicker

Stencil thickness

Electronics Forum | Thu Jun 09 07:02:02 EDT 2005 | ajaydoshi

1. We do have PCB with 0402 component, Micro BGA ( 0.5mm pitch , 0.25 mm pad size ). PCB thickness is 0.8mm. What stencil thickness we should use. PCB size 40 mm X 60 mm 2. We have EKRA E4 , What will be optimum setting for above. Pressure, Scquge s

Stencil thickness

Electronics Forum | Thu Mar 02 18:24:57 EST 2006 | stepheniii

NC or WS?

PCB thickness

Electronics Forum | Wed May 17 11:00:00 EDT 2000 | emmanuel

Has somebody yet process pcb (FR4) with a thickness of 0.8 mm ? Thank you for all kind of responses.

Soldermask thickness

Electronics Forum | Fri Oct 03 05:27:24 EDT 2003 | kanwal324

the puspose of solder mask is to prevent exposure of cu tracks to atmosphere. the lesser thickness can effect the performance of board but it only depends on its application. if you are making telecom board then its not good to use the board.

Plating thickness

Electronics Forum | Fri Sep 17 13:51:43 EDT 2004 | huib

We know from experiments that the structure of Sn can be manipulatedby means revese pulse-plating. This means alayer with less pits and thus a lower mminimum thickness is needed. www.ppcs.nu

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