Electronics Forum | Tue Jun 20 20:43:00 EDT 2000 | Dave F
Gary: Your flux supplier is the person for you to ask this question. For instance, the Lonco Superflo 26F that Jason was talking about last week has a preheat of 85�C to 110�C. * Thickness and number of layers of your board will affect you choice o
Electronics Forum | Wed May 24 12:15:53 EDT 2000 | Wolfgang Busko
Bill, I would assume that the stencil rests on the soldermask especially when you use a metallblade. If you know the difference in height between soldermask and land you could take that into your volume calculation when figuring out your desired ste
Electronics Forum | Mon May 22 09:13:12 EDT 2000 | Wolfgang Busko
Hi Sal, I don�t have the solution to your problems but my first thought is warpage. I�ve seen similar things caused by exessive warpage of PCBs 1,6mm thick sometimes and with 0,8mm and T-SOP 50% showed this symptom. Prebaking and a fixture to counte
Electronics Forum | Fri May 12 07:32:13 EDT 2000 | David Hatherall
Help. We are about to start a project to test the suitability of attaching a ceramic thick film hybrid to a pcb using solder balls. we have no previous experience of this technique and would like a few pointers in the right direction.. eg recommend
Electronics Forum | Thu Mar 23 13:48:07 EST 2000 | John Storjohann
A number of years ago I used a Kester product called Solder Saver. It is a thick liquid that one squirts onto the dross on a hot solder pot. It separates out the solder leaving a crust of almost clean dross. Unfortunately a mask is still required. Th
Electronics Forum | Thu Feb 24 06:09:26 EST 2000 | Robert Hutton-Squire
Hi, - any suggestions welcome... I have a 484 pin ALTERA fineline BGA - ball pitch 1mm (40) - ball size 0.48mm (18.9) What would you recommend for... 1. Surface pad size for the balls of this BGA device? 2. Stencil thickness/type and hole a
Electronics Forum | Tue Jan 30 15:30:17 EST 2001 | dason_c
Please check what is the actual pitch size. I found some of the designer use 15.7 mil pitch and no accumulate ie 15.7, 15.7 and 15.8...... Also, I recommended the pad width should be 10 - 11 mil for 0.4mm pitch. You can open the 10 - 10.5 mil aper
Electronics Forum | Thu Mar 22 16:19:40 EST 2001 | rwilliams
In regards to SMT adhesive application by stencil: Can anyone make any recommendations for: SMT Adhesive Material itself? Squeegee Blade Material? Stencil Material? Characteristics/Features of your Stencil? E.g., thickness, aperture ratios, etc... P
Electronics Forum | Fri Apr 20 11:05:23 EDT 2001 | gcs
Just a bullet! My results are, .005" stencil thickness should measure between .0055" - .006" if your pressure is correct, metal blades and snap-off is set up correctly. Do you have aperture reductions at the QFP locations "typicial industry standard
Electronics Forum | Mon May 14 18:31:20 EDT 2001 | genny
The experiment was to determine insertions from a > gold plated board into a connector. Same > thickness boards (0.062"), with 100 m base > nickel. � 100m gold =_ 500 insertions � 50 m > gold =_ 300 insertions � 30 m gold =_ 50 to 75 > insertio
