Electronics Forum | Sun Mar 21 21:27:26 EST 2004 | laxman
We are also facing this issue. Normally we are baking all MSD 24 HRS @125�C. This may not be a standard practice. I have read that depending on the Package thickness Baking time and temperature varies apart from the storage conditions of the IC. IS t
Electronics Forum | Wed Apr 07 10:10:00 EDT 2004 | ccl
thanks Dave, solder mask use is AUS 5 from Taiyo ink, solderability of the contam area is still pass the min spec. gold thickness is ~ 1 um and Ni layer is ~10um. can solder mask bleed cause contam? forget to tell the product is full body gold (FBG)
Electronics Forum | Fri May 21 20:48:09 EDT 2004 | My Nguyen
I read the messsages but I did not meet my need. We currently have Excellon and ATI machines. They work ok for thick boards (40 mils and above) but for thin, small boards (15-20 mils and USB side dimension), it did not fulfill our needs. So, pleas
Electronics Forum | Fri Jun 25 18:33:45 EDT 2004 | jsloot
We are doing what I believe is unique from everyone else. We are using a .010 thick flex circuit board populated with the usual components, sot-23, caps, resistors,etc. It is mountd to a carrier plate with the edges taped down but I am having troubl
Electronics Forum | Tue Jul 27 11:34:05 EDT 2004 | C Lampron
Nippy, This is exactly what we are seeing. The exessive pads are all on one side of the board. This is a 10 up panel 5x2. All of the QFP's on one side on the panel are not releasing or are not gasketing and causing bridging. So the defects are rangi
Electronics Forum | Thu Aug 05 04:51:37 EDT 2004 | Bryan
The ball pitch is 1.10mm and the pad diameter is 0.45mm,so we designed the aperture diameter as 0.45 on 0.13mm thick stencil.Bridging rate decreased a great deal,but the balls still deformed in the same area.and found it no use reducing the reflow ti
Electronics Forum | Fri Aug 06 07:16:36 EDT 2004 | davef
When moisture outgasses through plating, it continues through the molten solder, causing a meak solder connection. There's another issue with thin plating that we haven't focused on in this thread. If plating is thin, the stress on the barrel of a
Electronics Forum | Wed Aug 11 16:09:50 EDT 2004 | Kris
Hi How does one distinquish between hard gold and immersion gold ? thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel what happens if the gold drops below 3" and the nickel is above 350" what are the typical failure modes associated with
Electronics Forum | Thu Sep 02 18:39:48 EDT 2004 | steveg
We're having a lot of problems with failed solder joints to gold-plated MOSFET leads. Gold plate thickness spec is 60uin, but we've seen as much as 200uin in cross-section, so we're obviously concerned about gold embrittlement issues. Pre-tinning w
Electronics Forum | Wed Oct 20 17:59:41 EDT 2004 | Grayman
Steve, I have also requirements for this machine. I was able to evaluate some of these machines but the result was not ok. It burn the PCB especially if you have 5mm thick PCB. If you can find one that doesn�t burn PCB please let me know as I am als
