Electronics Forum | Wed May 17 13:48:37 EDT 2006 | dwelch123
I'm having trouble printing leads on a fine pitch part. The lead is only .008". I'm using a DEK 265 with metal squeegee and using WS200 multicore solder paste.The stencil is laser cut and polished. I've experimented with different pressures and diffe
Electronics Forum | Tue May 30 07:41:21 EDT 2006 | davef
Aspect ratio: The ratio of a via�s length or depth to its pre-plated diameter. So, in your case, either * 6=0.093/x, calculating x=0.093/6=0.016 as the smallest via hole diameter. ... OR * 6=y/0.01, calculating y=6*0.01=0.06 as the maximum board th
Electronics Forum | Thu Jun 01 08:39:36 EDT 2006 | russ
IPC a 610 has this info. An 0402 however mat require more solder than what IPC states (basically evidence of wetted fillet for class2). more paste = more flux = better wetting. Why don't you tell us what pad sizes and layout you have and stencil t
Electronics Forum | Fri Jun 02 03:41:04 EDT 2006 | geb
Found the aramid fabric (Kevlar) on the website you suggested. Which thickness Aramid-and-Fiberglass Sheeting should I get, do I need to buy a strip as well to protect up to 600F? I was going to use PTFE-Coated Fiberglass Thread as it is rated up to
Electronics Forum | Fri Jun 09 11:52:59 EDT 2006 | Rob
Yes you can solder on to it - just tried it with some 0603's across some gold fingers with tin lead paste & a heat gun. Don't know how many times you could rework it though. Any chance you could get hold of an aold populated board from your custome
Electronics Forum | Wed Jul 12 11:46:00 EDT 2006 | flipit
Hi, One other note. You don't want gold to be more than 1% to 2% of the the solder joint. Above this percentage you will have embrittlemant issues. Lots of information on gold embrittlement on this site and on the Internet. I estimate your produ
Electronics Forum | Wed Aug 09 09:54:36 EDT 2006 | russ
Use ENIG, plated finish will be too thick and make for a brittle joint. ENIG is self limiting so this condition cannot be present. To ensure that the bond is strong for BGA you must ensure that process is under control. The correct reflow profile w
Electronics Forum | Fri Sep 22 17:36:35 EDT 2006 | mika
A bunch of thanks guys, we will take this in consideration. BTW, we will not go for the v-grove in the panel (2x8 boards + the extra cut of areas). The board house recommended us to go for braces/hinges, since this thin pcb-panel could easily break w
Electronics Forum | Tue Sep 19 22:55:21 EDT 2006 | darby
Hi Larry, me again. Painting the tip should do diddly because you are using laser. Your cap is probably passing because it's thicker and is just inside the range of the system set-up. Check and calibrate your nozzle alignment height settings. Input t
Electronics Forum | Wed Dec 20 16:30:40 EST 2006 | CK the Flip
I've seen smaller components have a "charred" appearance and a lack of wetting up the component termination. Also, extended heat exposure may introduce excessive IMC (intermetallic) formation - the bad kind, that is. That's where your IMC layer wil
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