Electronics Forum | Sat Oct 31 01:22:35 EDT 2009 | mysmt
We have performed some EDS analysis and found > high percent (approx 18% ) of Ni on surface of > gold pad. Found Tungsten as well. This is an > HTCC alumina package. Thickness of gold was > confirmed and found to be in spec. We believe > we
Electronics Forum | Wed Nov 25 01:00:54 EST 2009 | henry_usa_stencils
The design of the opening apertures for the glue stencil and the metal thickness.Its is very important. The Engineer of the stencils supplier have to look into the height of the components and the gap of the 2 leg(pads)and give the assemly house an s
Electronics Forum | Wed Dec 02 10:14:42 EST 2009 | duso02
As a large coating house we use 1B73 daily and we have very few issues with bubbles. We very rarely bake it as the air cure is so short. Also, we only use thinner 73 vice 521. Another question would be; how is it being applied? How thick are you appl
Electronics Forum | Fri Apr 09 15:00:04 EDT 2010 | davef
So for your SMT1/SMT2/PTH boards, you have poor solderability during SMT2. [Even if you have no SMT2 and only ST1/PTH, our answer is the same.] We assume this occurs on one board part number only. We guess that your bare boards have insufficient gol
Electronics Forum | Tue Jun 08 17:12:42 EDT 2010 | flipit
Kic Thermal used Pyropel. Cut with a razor blade and glue together with a good Dow Corning high temperature silicone. You can buy Pyropel in various thicknesses. It is not cheap. $100.00 for a 24" X 24" X 3/16" sheet. You can buy at McMaster Car
Electronics Forum | Thu Feb 09 09:18:22 EST 2012 | swag
I'm not familiar with Quad but I have had very similar problems on printers. If your conveyor has an L-bracket over the top of the conveyor belt to keep it down + aligned, you might need to remove it for cleaning or make some adjustments to it so it
Electronics Forum | Fri Mar 09 15:13:49 EST 2012 | davef
Care must be taken to not apply an excess of material, as the adhesive will flow under the device during placement and curing, and could cause a short. Printer setup: * Don't worry about stencil thickness. A wide range of stencil thicknesses (typic
Electronics Forum | Wed Aug 08 12:14:26 EDT 2012 | jorge_quijano
Hi, We have a client requiring us to use a Vapor Phase Reflow Oven instead of our convection oven, the new PCB design will be ~9.3mm thick with some SMD & Pressfit connectors, does the PCB thick could be the cause of they requiring us the Vapor Phase
Electronics Forum | Tue Sep 25 11:50:37 EDT 2012 | davef
Ken ... I resized your picture so that it fits on the page better. Continuing with your outgassing through the solder pads theory, how thick is the copper on the pads? I don't expect to see outgassing through pad that are a thou or more in thickness
Electronics Forum | Mon Jan 21 17:59:11 EST 2013 | jorge_quijano
I had a similar situation with a very thick PCB (0.23") I could not get a TAL lower than 160 sec, I've spoken with my paste supplier about this issue and we have made some adjustments on the oven and we could lower it to 145 sec, I know it is higher
