Electronics Forum | Mon Apr 08 00:08:00 EDT 2019 | jamestong
With the increase of labor costs, the popularity of automated production lines, IC tubes, connector tubes, power module tubes, LED tubes, relay tubes and other electronic components tubes are also becoming more widely used. Many small companies blind
Electronics Forum | Thu Jul 10 09:55:47 EDT 2003 | davef
A reading of the pictures is: A1: Looks like pad [B1] is smaller than the other pads. It�s weird that the pads are such different colors. A2: Looks like pad [B1] is smaller than the other pads. Solder mask opening [B1] is misregistered and seems s
Electronics Forum | Tue Nov 07 09:26:37 EST 2000 | Peter Barton
Adam, The most common cause for this problem is a variation in the plating thickness of the through holes, particularly if they are Sn/Pb solder levelled PCB's. Most pressfit connectors require a fairly tight control on the diameter of the holes to
Electronics Forum | Wed Nov 01 12:19:42 EST 2000 | Fraser
Steve, someone somewhere is feeding you a line!! if you increase the draft angle from || to / \ on your laser cut stencil you increase the surface area of the side wall and hence increase the likelyhood of the paste sticking in the aperture. Whats m
Electronics Forum | Wed Oct 11 16:24:35 EDT 2000 | John Thorup
Hello Antonio ASPECT RATIO = the ratio of one dimension to another as in the ratio of the thickness of a stencil to the width of the aperture. For instance, a 10 mil aperture in a 5 mil stencil will have an aspect ratio of 2. This is aperture width
Electronics Forum | Wed Jun 28 12:37:05 EDT 2000 | Brian W.
HASL plating, by its very nature, is inconsistent in terms of thickness and consistency. The plating varies from spot to spot on the pad, as well as pad to pad. This will wreak havoc on your screen printing process and your placement. From talking
Electronics Forum | Tue Apr 04 04:55:31 EDT 2000 | Jesper K
It's a typical answer from a board fabricator - 'None of our other customers have these problems'. But, and correct me if I'm wrong, none of the other customers uses the same PCB's as you do! Your preheat-parameters looks OK - they should not be giv
Electronics Forum | Wed Feb 07 09:46:20 EST 2001 | pjc
I need some guidance here. I've got a new board w/ a FBGA-48 package, Samsung CMOS SRAM. It's a full matrix BGA w/ 0.30mm-0.40mm ball diameter @ 0.75mm pitch. Balls are eutectic. PCB land diameter is 0.4mm. There are TSOP I 0.5mm lead pitch component
Electronics Forum | Mon May 21 17:37:51 EDT 2001 | davef
IPC-2222, Sectional Design Standard For Printed Board For Organic Printed Boards talks to scoring parameters in para. 5.3.1. You can obtain the standard at: http:///www.ipc.org. and Document Center [http://www.document-center.com/home.cfm/sid=71285
Electronics Forum | Mon Jun 18 21:20:17 EDT 2001 | davef
It�s sometimes tough to put enough paste on the board before reflow to obtain half-way adequate hole fill with components on a 0.062 inch thick board. So, a 0.093 incher, um. Yano, a lot is determined by board lay-out and how you jigger your profil
