Electronics Forum: thickness and increase and at and reflow (Page 1 of 1)

solderability and hasl thickness

Electronics Forum | Wed Sep 10 12:56:09 EDT 2003 | davef

Intermetallic compounds [IMC]: * Form during the alloying process of some metals. In soldering these are Sn, Ni, Ag, Cu, Au. * Do not accept solder. * Increase in depth in logarithmic proportion to both time and temperature. [So during the solder

Re: Humidity Control and Moisture Sensitivity

Electronics Forum | Tue Dec 05 15:10:55 EST 2000 | Francois Monette

Victor, here are a few more elements of information to answer your question. Both the temperature and relative humidity on the manufacturing floor have a significant impact relative to the rate of diffusion of moisture inside a plastic package and t

Re: Adhesive Dispenser Vs. Screen Printing Adhesives Pros and Cons

Electronics Forum | Thu Oct 12 22:16:59 EDT 2000 | Dreamsniper

Hi Guys, I'd like to share this to all of you...you can start playing with the rests...Stated prices, if not indicated, are in Aussie $ or Singapore $. Stencil Printing Adhesive Pros a) Less Capital Equipment Cost (Short Term). In reality it is f

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Thu Sep 26 11:44:23 EDT 2002 | abelardo

Hello everyone out there in the SMT world. I have a dilema I'm currently running a board that has 3 csp's with a .75 mm. ball pitch and .3mm ball size. And 2 qfp's-160. The stencil is 4 mils thick and I'm using a 63/37 solder paste. My reflow prof

Reflow Temperatures and speed for a 7 zone top/bot for conceptro

Electronics Forum | Wed Jun 25 18:17:48 EDT 2003 | Brian W.

Water soluble pastes generally work best with a ramp-to-spike reflow profile. Check your paste manufacturer's recommended profile. There are many factors that impact your profile; board thickness, component density, buried thermal masses, board si

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