Electronics Forum | Thu May 18 08:12:22 EDT 2006 | marc
smt You should have no issue using your exsisting oven for both leaded and lead free materials if the machine is capable of delivering the desired profiles. One aspect that makes a "lead free" oven is the design of the system. Ability to reach th
Electronics Forum | Wed Jun 04 18:46:10 EDT 2014 | hegemon
Well, we cannot make the cuts any deeper as then > we would incur a significant amount of "bowing" > at SMT placement/reflow. Interesting. Could be a number of factors contributing. Here's a story.... In the beginning was the board design, and in
Electronics Forum | Wed Sep 10 12:56:09 EDT 2003 | davef
Intermetallic compounds [IMC]: * Form during the alloying process of some metals. In soldering these are Sn, Ni, Ag, Cu, Au. * Do not accept solder. * Increase in depth in logarithmic proportion to both time and temperature. [So during the solder
Electronics Forum | Fri Jan 03 12:01:46 EST 2003 | jax
Alot of the companies out there use Standards developed internally, centered around there paste, equipment, and reflow processes. Normally you will see either 5mil or 6mil stencils used for everything in house with the exceptions of specific boards.(
Electronics Forum | Tue Feb 20 16:31:49 EST 2001 | davef
Let�s be basic. The two most common causes of BGA opens that we talk about here are: 1 Gold thickness and 2 Black pad. Given the thickness of gold that you talking about, it�s reasonable to consider thickness as the first alternative to investigat
Electronics Forum | Tue Aug 15 19:07:13 EDT 2006 | vlad_uk
With the added temperature peak associated to Lead free reflow is anyone seeing or concerned about the increased vapor pressure that may result from moisture entrapment in moisture sensitive components?
Electronics Forum | Tue Nov 21 09:46:19 EST 2006 | jax
I assume you are talking about Sn62Pb36Ag2 solder. You should not see any added concerns when subjecting Sn62 to multiple reflow cycles as compared to Sn63. As compared to Sn63Pb37: Reduced leaching issues Increased Wetting due to lo
Electronics Forum | Thu May 21 09:54:07 EDT 1998 | Justin Medernach
| I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and solde
Electronics Forum | Mon Jun 02 15:03:05 EDT 2014 | clydestrum
Background on the PCB: Thickness: .032" Material: Standard Fr4 V-score: Leaves .016" (approx .008" cuts on either side) We are having some issues on these boards where the edges are delaminating all the way to the copper during de-panel. Now, we are
Electronics Forum | Tue May 26 14:50:07 EDT 1998 | Dave F
| | I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and sol
